The next offering in Indium Corporation’s acclaimed InSIDER Series of webinars will be a discussion on the challenges with high-reliability power electronics assemblies and an overview of some of Indium Corporation’s innovative materials solutions. Joe Hertline, product manager – ESM/Power Electronics, will host the webinar on Tuesday, Feb. 8 at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London/5 p.m. Germany.
The InSIDER Series—Indium Corporation’s free webinar program inaugurated in April 2020 – has included more than 30 topics presented to thousands of industry professionals via its live sessions and recordings archive.
As power devices evolve to handle increased power density, higher junction temperatures, and smaller packaging, the enhanced requirements for high-reliability power electronics have posed many challenges to the packaging and assembly processes. In The Challenges of High-Reliability Power Electronics Assembly and the Emerging Materials Solutions, Hertline will analyze the major challenges within substrate- and die-attach applications, as well as provide an overview of the innovative materials solutions that can help achieve high power density and promote better heat dissipation, resulting in highly reliable power devices.
You can register for this webinar at https://indium.news/3rfHiam.
Hertline is responsible for driving the growth of the power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Hertline also collaborates with Indium Corporation’s sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. Prior to joining Indium Corporation in the spring of 2020, Hertline spent more than 10 years as an engineer and product manager in the electronics industry.
About Indium Corporation
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit indium.com
