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PICMG Bolsters New COM-HPC “Mini” Form Factor with Release of Carrier Design Guide Revision...
PICMG®, a consortium for open hardware specifications, has released revision 2.2 of the COM-HPC® Carrier Design Guide. This comprehensive document contains interface schematics, diagrams,...
Joel Scutchfield from Koh Young Invites Electronics Manufacturers to see its Data-Driven Approach to...
Koh Young, the industry leader in True3D measurement-based inspection solutions and the Premier Sponsor of IPC APEX EXPO, invites electronics manufacturers to see its...
SMTA Announces Workforce Development Breakfast at Ultra High Density Interconnect (UHDI) Symposium
The SMTA is excited to announce a Workforce Development Breakfast Panel, “Building Tomorrow’s Expertise,” taking place on March 26, 2024 in Peoria, Arizona, USA....
AIM Solder Recognized for 25 Years of IPC Membership
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its receipt of recognition for 25...
North American PCB Industry Sales Down 3.9 Percent in January
IPC announced today the January 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.93.
Total North...
Ventec Giga Solutions Announces Exclusive Refurbishment Service for PCB Lamination Plates
Ventec Giga Solutions, the equipment division of Ventec International Group, has started offering a refurbishment service for separator plates used in PCB lamination processes....
Green Circuits Presents Custom PCB Solutions for Satellite Assembly at Satellite 2024 Exhibition
Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, proudly announces its participation in the Satellite 2024 Conference & Exhibition, scheduled...
Kerafol and X2F Partner to Revolutionize Thermal Solutions for Electronic Devices
Kerafol and X2F are teaming up to develop state-of-the-art thermal management solutions for electronic devices by leveraging the advantages of Kerafol's thermally conductive materials...
MultiEyeS plus with augmented reality-based placement assistance
With the MultiEyeS plus, GÖPEL electronic offers a powerful automatic optical inspection module for integration into assembly and THT placement stations. To improve manual...
IPC and the PCBAA Urge Congress to Fully Fund Printed Circuit Boards or Face...
In a letter signed by 54 microelectronics executives, IPC and Printed Circuit Board Association of America (PCBAA) are calling on Congress to fully fund...
