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Silicon Valley Electronics Manufacturer Expands Services To Support Growing US Demand

Flex Interconnect Technologies (FIT), a leading US flexible circuit fabricator, has launched its own circuit board assembly service. This expansion will bolster support for...
Genie Electronics Leverages Cetec ERP for Superior Efficiency and Customer Service

Genie Electronics Leverages Cetec ERP for Superior Efficiency and Customer Service

Cetec ERP is pleased to announce that Genie Electronics, a subcontract manufacturing company with a diverse portfolio in the automotive, medical and commercial industries,...

PDR Appoints Bob Pearson of PAC-Global Texas to Central Texas Region

PDR Americas X-RAY Systems is pleased to announce the appointment of Bob Pearson from PAC-Global Texas as the new representative for the Central Texas...

Dispensing & Coating Expert PVA to Exhibit with Maxim SMT at SEMICON India 2024

PVA, a global supplier of automated dispensing and coating equipment, is pleased to announce its participation in SEMICON India 2024, taking place Sept. 11-13,...

Silicon Mountain Contract Services Announces Preparation for ITAR Registration

Silicon Mountain, a family-owned leader in electronics manufacturing located in the heart of the Pacific Northwest, proudly announces its initiation of preparations for International...

AIM to Present on Ultra-Miniature Assembly for Mini/MicroLEDs at MicroLED Connect

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming MicroLED...

AI in Electronics Free Panel Discussion at PCB West 2024

The Printed Circuit Engineering Association (PCEA) today announced a special free panel session on AI in Electronics will take place at the PCB West...
Bold Laser Automation Announces Precision Thickness Measurement System for Films, Foils, and Fabric

Bold Laser Automation Announces Precision Thickness Measurement System for Films, Foils, and Fabric

Bold Laser Automation, a leader in precision laser system design, proudly announces its latest metrology innovation: the Bold 3DS Series Confocal Thickness Measurement System...

South-Tek Systems: Increasing Miniaturization Drives the Need for Nitrogen in the Reflow Process

As electronics continue to shrink in size, the demand for nitrogen in the reflow soldering process has grown significantly. South-Tek Systems, a leading provider...
TopLine to Exhibit “Drop-in Replacement” for BGA at Electronica

TopLine to Exhibit “Drop-in Replacement” for BGA at Electronica

TopLine® Corporation will exhibit its latest technology solutions at Electronica in Munich, Germany, November 12 – 15, 2024, in stand B4.428. The exhibit will...