Heraeus Electronics and Bosch Sign Patent and Know-How License Agreement for Inorganic Potting Technology at PCIM Europe Exhibition

Heraeus Electronics and Bosch Sign Patent and Know-How License Agreement for Inorganic Potting Technology...

Heraeus Electronics and Robert Bosch GmbH have signed a patent and know-how license agreement at the PCIM Europe exhibition in Nuremberg, Germany. The agreement...
Celanese Announces Collaboration with nScrypt to Advance Printed Electronics Space

Celanese Announces Collaboration with nScrypt to Advance Printed Electronics Space

Celanese today announced a new strategic partnership between its Micromax™ Electronic Inks and Pastes and nScrypt, which designs and manufactures high-precision microdispensing and direct...
SHENMAO Debuts Visible No-Clean BGA Flux SMBF-08 for Enhanced SMT Assembly and BGA Ball Mount Process

SHENMAO Debuts Visible No-Clean BGA Flux SMBF-08 for Enhanced SMT Assembly and BGA Ball...

SHENMAO America, Inc. is proud to announce the release of its new SMBF-08 Visible No-Clean BGA Flux. This innovative flux is specifically designed to...
KYZEN to Spotlight Stencil Cleaning Solvents at the SMTA Aguascalientes Expo and Tech Forum

KYZEN to Spotlight Stencil Cleaning Solvents at the SMTA Aguascalientes Expo and Tech Forum

KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Aguascalientes Expo and Tech Forum, scheduled to take place...
Automating wedge bonding for complex wire components

Automating Wedge Bonding for Complex Wire Components

RF and mmWave specialist, Filtronic has further enhanced its hybrid and semiconductor packaging capabilities by investing in a fully automated wedge bonder suitable for...
Cortec® Presents Latest Packaging Innovation: CorShield® Resealable Bubble Bags Powered by Nano-VpCI®!

Cortec® Presents Latest Packaging Innovation: CorShield® Resealable Bubble Bags Powered by Nano-VpCI®!

CorShield® Resealable Bubble Bags and Static Shielding Bubble Bags combine volatile corrosion inhibitors with cushioning packing bubbles to provide protection for sensitive or delicate...
ZESTRON South Asia releases whitepaper “Critical Cleaning Requirements To Overcome Advanced Packaging Defluxing Challenges”

ZESTRON South Asia Releases Whitepaper “Critical Cleaning Requirements To Overcome Advanced Packaging Defluxing Challenges”

ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to...

Heraeus Marks the Second Anniversary of its Center of Excellence for Advanced Packaging in...

Heraeus Electronics celebrated the 2nd anniversary of its Center of Excellence for Advanced Packaging in Singapore with a customer event. Established in April 2020, the...
BTU Partners with iRaptor to Offer Advanced Profiling Technology

BTU Partners with iRaptor to Offer Advanced Profiling Technology

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced a new strategic partnership with iRaptor...
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CHIPS Act Implementation Requires Strong Focus on “Advanced Packaging,” Industry Leaders Say

Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the U.S. government and European Commission are gathering in Washington, D.C....