SolderKing to Reinforce UK Manufacturing and Supply Reliability at Southern Manufacturing & Electronics 2026 Stand J90

SolderKing to Reinforce UK Manufacturing and Supply Reliability at Southern Manufacturing & Electronics...

With increased focus on supply chain resilience and consistent material performance across the electronics sector, UK-based solder consumables manufacturer SolderKing Assembly Materials Ltd will...
AIM Solder Signs New Distributor in Vietnam

AIM Solder Signs New Distributor in Vietnam

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the signing of RMG Vietnam Co.,...
Indium Corporation Launches New Solder Paste for High Print Consistency and Easy Cleanability

Indium Corporation Launches New Solder Paste for High Print Consistency and Easy Cleanability

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of SiPaste® C312HF, a halogen-free, cleanable solder paste formulated...
KYZEN’s Beth Bivins Honored as MetalForming Magazine’s 2025 Woman of Excellence

KYZEN’s Beth Bivins Honored as MetalForming Magazine’s 2025 Woman of Excellence

KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is excited to announce that Beth Bivins, who serves as Global Product Manager –...
Indium Corporation Expert to Present on Advancements in Bi-free In-containing Lower-Temperature Solder at ICEE 2025

Indium Corporation Expert to Present on Advancements in Bi-free In-containing Lower-Temperature Solder at ICEE...

Indium Corporation’s Senior R&D Manager of the Alloy Group, Hongwen Zhang, Ph.D., will present on the company’s award-winning Durafuse® Technology during the IEEE International...
SHENMAO Technology, Inc. Launches SMF-TA52, a Zero-Residue Transient Adhesive Designed for Formic Acid Reflow

SHENMAO Technology, Inc. Launches SMF-TA52, a Zero-Residue Transient Adhesive Designed for Formic Acid Reflow

SHENMAO Technology, Inc. has introduced its new SMF-TA52 transient adhesive, a material created specifically for the growing use of formic acid reflow soldering in...
Intersurface Dynamics Signs Exclusive Representative Agreement with Legatech for the United Kingdom and Nordic Region

Intersurface Dynamics Signs Exclusive Representative Agreement with Legatech for the United Kingdom and Nordic...

Intersurface Dynamics, a subsidiary of Amtech Systems, Inc. and a manufacturer of application-specific chemicals used in the production of semiconductor devices and substrates announced...
Act Now: MicroCare Fluids to Replace Discontinued 3M Novec™ Specialty Fluids

Act Now: MicroCare Fluids to Replace Discontinued 3M Novec™ Specialty Fluids

With 3M discontinuing all Novec™ Specialty Fluids in 2025, electronics manufacturers face urgent sourcing challenges. MicroCare™ offers ready-to-ship, precision-matched replacements through its Tergo™ Performance...
Metalysis Begins Commercial Production of High Scandium Loading Aluminium Scandium (Al₃Sc) Alloy Powder

Metalysis Begins Commercial Production of High Scandium Loading Aluminium Scandium (Al₃Sc) Alloy Powder

Metalysis, the end-to-end manufacturer of solid-state metal and alloy powders, and global leader in materials science, is now producing high-purity aluminium scandium alloy powder...
KYZEN Celebrates Its 100th Industry Award

KYZEN Celebrates Its 100th Industry Award

KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that it has received its 100th industry award, a milestone...