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New Wide-View UV Magnifier with White & Ultraviolet LEDs
Aven, a full-service technology provider, is pleased to introduce its Wide-View Magnifier with Ultraviolet and White LEDs. Convenient and easy-to-use, Aven’s Wide-View UV...
IPC, First and Only Organization in the Electronics Industry to Earn ANSI/ANAB Accreditation for...
IPC, the global leader in electronics education, announces a landmark achievement in professional education and training. Ten of IPC’s critical workforce training programs have...
YINCAE Launches Snap Cure, Highly filled,100% No-Clean Flux Residue Compatible Underfill: UF 120HA
YINCAE, a leading manufacturer of electronic materials, has announced the
launch of its new product, UF 120HA. The innovative underfill material is specifically designed...
Vexos Expands Operations with the Acquisition of ControlTek, a World-Class Manufacturing Facility in Vancouver,...
Vexos, a leading global Electronic Manufacturing Services (EMS) and Custom Material Solutions (CMS) provider, is excited to announce the successful acquisition of the cutting-edge...
Thermaltronics Appoints Horizon Sales as Newest Rep
Thermaltronics USA, Inc. is proud to announce the appointment of Horizon Sales as its newest rep, covering the territories of Michigan, Ohio, Indiana, Kentucky,...
Silicon Mountain Joins Idaho Manufacturing Alliance to Strengthen Tech Community and Promote ‘Made in...
Silicon Mountain, a leading electronic manufacturing company, is proud to announce its membership in the Idaho Manufacturing Alliance (IMA). This partnership reflects Silicon Mountain’s...
Juan Arango Joins Inovaxe as Senior VP Sales & Marketing Americas
Inovaxe, a world leader and provider of innovative material handling and inventory control systems, today announced the appointment of Juan Arango to Senior VP...
Soldering and Joint Encapsulation with One Step Reflow from SHENMAO
SHENMAO America, Inc.’s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and...
SUSS MicroTec and DELO announce collaboration on imprint lithography
SUSS MicroTec and DELO cooperate in the optimization of imprint manufacturing processes for the production of wafer-level optics (WLO). These optics are essential for...
Indium Corporation Showcases Metal Thermal Interface Materials for Burn-In and Test at TestConX
Indium Corporation® is set to showcase its advanced metal thermal interface materials (TIMs) for burn-in and test at TestConX 2024, March 3-6 in Mesa,...
