PCB West 2025

Users to Lead Free ‘AI in Electronics’ Panel at PCB West 2025

The Printed Circuit Engineering Association (PCEA) today announced a special free panel session on “What Users Really Think of Today’s AI.” The one-hour session...
Clemsa Achieves up to 75% Faster Changeovers and Higher Quality with Europlacer SMT placement line

Clemsa Achieves up to 75% Faster Changeovers and Higher Quality with Europlacer SMT placement...

Clemsa, a manufacturer based in Spain and part of the Italy-headquartered FAAC Technology Group, has transformed its electronics production capabilities through the installation of...
AIM Solder Announces New Distribution Partnership with Covermat Co., Ltd. in Thailand

AIM Solder Announces New Distribution Partnership with Covermat Co., Ltd. in Thailand

AIM Solder, a leading global manufacturer of solder assembly materials, is pleased to announce the appointment of Covermat Co., Ltd. as its official distributor...
KYZEN to Focus on AQUANOX A4618 and Process Control at SMTA Ohio Valley Expo and Tech Forum

KYZEN to Focus on AQUANOX A4618 and Process Control at SMTA Ohio Valley Expo...

KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Ohio Valley Expo & Tech Forum on Thursday, August...
Magnalytix’s Dr. Mike Bixenman to Guide PDC at SMTA High-Reliability Cleaning and Conformal Coating Conference

Magnalytix’s Dr. Mike Bixenman to Guide PDC at SMTA High-Reliability Cleaning and Conformal Coating...

Magnalytix, providing real-time reliability solutions for electronics manufacturing, is excited to announce that Dr. Mike Bixenman will present the professional development course “The Effects...
Federal Electronics Mexico Enhances SMT Line with Installation of Heller Industries Reflow Oven

Federal Electronics Mexico Enhances SMT Line with Installation of Heller Industries Reflow Oven

Federal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its surface mount technology (SMT) operations with the installation of a new...
Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices

Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping...
ASMPT introduces MEGA multi-chip bonding platform

ASMPT Introduces MEGA Multi-chip Bonding Platform

ASMPT SEMI, a leading provider of forward-looking solutions for advanced packaging and semiconductor assembly, sets the standard in precision and speed with its new...
Astute Group Appointed Global Distributor for Puya Semiconductor's Memory & Microcontroller Solutions

Astute Group Appointed Global Distributor for Puya Semiconductor’s Memory & Microcontroller Solutions

Global electronics distributor and supply chain partner, Astute Group, today announced a new strategic distribution agreement with Puya Semiconductor, a leading supplier of ultra-low...
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Ohio Valley Expo & Tech Forum

AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Ohio Valley...

AIM Solder is pleased to announce its participation in the upcoming SMTA Ohio Valley Expo & Tech Forum. This event takes place on August...