Electronics Manufacturer Opens 37,000 SQ. FT. Headquarters in Charlotte, NC

Family-owned electronics assemblies manufacturing company expands to support economic development and growth of the electronics industry and bolster the local economy. “This move is...
Surfx Plasma head

SurfX Plasma Machine Cleans and Activates Surfaces In-line and Damage Free

Surfx Technologies, LLC, the most trusted name in atmospheric plasma, will exhibit at The Adhesives and Bonding Expo, scheduled to take place June 28-30,...

Ventec Giga Solutions to Distribute Hi-Print Inkjet Portfolio for Precision PCB Printing

Ventec Giga Solutions, the equipment division of Ventec International Group (6672 TT) that delivers turnkey workflow solutions, including equipment selection, installation, and commissioning, has...
E-Tronix to Host BTU Webinar on Solder Reflow Oven Fundamentals and Thermal Profiling Approaches

E-Tronix to Host BTU Webinar on Solder Reflow Oven Fundamentals and Thermal Profiling Approaches

E-tronix, a Stromberg Company, is excited to announce an upcoming webinar in collaboration with BTU. The “Solder Reflow Oven Fundamentals and Thermal Profiling Approaches”...

Variosystems Strengthens its Global Engineering Expertise

Variosystems, the globally operating system provider for high-quality electronic solutions, reaches another milestone moment in the company's development. In opening of the global Engineering...
McDermid Alpha to Present Automotive Traction Module Attach by Silver Sintering - Process, Performance & Reliability

MacDermid Alpha to Present Automotive Traction Module Attach by Silver Sintering at IEMT Conference...

MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will present the technical paper: “Automotive Traction...
MPM Edison II ACT with Cart connected

ITW EAE to Showcase New Printer and Dispenser Developments at Semicon Taiwan

ITW EAE will be showcasing its latest printer and dispenser developments at Semicon Taiwan, December 28-30 at the Nangang Exhibition Center in Taipei. Applications...

Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production

The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components...
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics

KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics

KONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating...
Does Clinch Technology Still Have a Place in Modern Manufacturing?

Does Clinch Technology Still Have a Place in Modern Manufacturing?

SMT dominates the majority of PCBA, but through-hole technology refuses to go away. In the current climate, where developments in power applications for rechargeables,...