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SMTA International Technical Conference Program Announced
The SMTA announced that the technical program of their annual conference, SMTA International, is finalized and registration is now open. The event will be...
Seica at 2026 APEX EXPO, a Powerhouse of Smart Innovation, High Performance and Integrated...
Seica, Inc. will return to the APEX EXPO, taking place March 17–19, 2026, at the Anaheim Convention Center, where the company will present its...
VERMES Microdispensing registers subsidiary in India in response to the move of major customers...
VERMES Microdispensing today announced the opening of its own subsidiary in India, VERMES Microdispensing India Private Limited, based in the country’s IT capital, Bengaluru.
VERMES...
SGS Simplifies Multi-Market Compliance for Electrical and Electronic Manufacturers
SGS, the world’s leading testing, inspection and certification company, is reaching out to electrical and electronic (E&E) manufacturers to help them overcome the challenges...
Computrol Brings on New A&E Manager
Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronic manufacturing services to OEMs, is pleased to announce that it has hired a...
VJ Electronix Wins 2022 NPI Award for New Microfocus X-ray Inspection System
VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce that...
KYZEN to Highlight AQUANOX A4618 and ANALYST2 at SMTA Rocky Mountain Expo and Tech...
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Rocky Mountain Expo and Tech Forum, scheduled to take...
Saki Opens New Mexican Office in the Guadalajara Metropolitan Area
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces the opening of its new Mexican office in Zapopan,...
YINCAE Launches UF 66L Optical Clear Underfill for High-Reliability Silicon Photonics and Optoelectronic Packaging
YINCAE is proud to announce the release of UF 66L, a next-generation Optical Clear Underfill (OCU) engineered for silicon photonics, optoelectronic packaging, image sensors,...
Double Excellence: KONIG’s KP400 Wins Two Top Honors at NEPCON Asia
KONIG, a leader in electronic packaging protection solutions, received two major awards on the opening day of NEPCON Asia for its breakthrough 3D Digital...
