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STI Electronics, Inc. Hires Brian Tharp as Quality Manager
STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping and contract PCB assembly, announced that Brian Tharp has been...
SMAC Launches Precise, Lower-cost Actuator for Electronic Assembly
SMAC Moving Coil Actuators today introduced its LDR16 Series electric linear rotary actuator designed for electronic assembly applications.
The LDR16-035 is the first of a...
Spectrum Assembly Ensures Smooth Production with the Nordson Assure™
Nordson TEST & INSPECTION, a division of the Nordson Corporation (Nasdaq: NDSN), announced that Spectrum Assembly, Inc. (SAI) has purchased an Assure™ X-ray Component Counter....
Indium Corporation to Present Technical Paper at SEMI-THERM
Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen will present a technical paper at SEMI-THERM, taking place March 13–17 in San...
Federal Electronics Expands Selective Soldering Capabilities with Installation of Pillarhouse Jade S-200 MKII System...
Federal Electronics, a leader in providing advanced electronic manufacturing services, has installed a new Pillarhouse Jade S-200 MKII selective solder system at its Hermosillo,...
TAGARNO Achieves Record Quarterly Sales in Q1 2024
TAGARNO, a leading provider of digital microscopy solutions, has proudly announced its record-breaking quarterly sales for Q1 2024, marking a substantial milestone in the...
Achieve Optimal Uniformity with BTU’s TrueFlat Technology at SEMICON Taiwan
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will highlight its TrueFlat™ reflow oven technology at...
Koh Young Case Study Underlines the Power of Supplier Partnerships with IMI
Koh Young has released their latest case study exploring their global partnership with IMI and specifically the success the collaboration has achieved at IMI’s...
YINCAE Launches Breakthrough Thermal Underfill: UF 158A2
YINCAE, a leading manufacturer of high-performance electronic materials, has announced the release of its breakthrough product: Thermal Underfill - UF 158A2.
Designed for use in...
Mycronic Receives Order for Three SLX Mask Writers
Mycronic has received an order for three SLX mask writers from an existing customer in the US. The order value is in the range...
