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CTTi partners with Horizon Sales to open new IPC training center in Michigan
Circuit Technology Training, Inc. (CTTi) is proud to announce the opening of a new IPC training center in Michigan, hosted by Horizon Sales in...
Achieve Industry 4.0 Capabilities by Digitizing Operations, NPI to High-Volume Global Production
Intraratio, a provider of enterprise software solutions, is pleased to offer RunCard, a fully digitized traceability system for advanced manufacturing operations. RunCard provides real-time...
VERMES Microdispensing registers subsidiary in India in response to the move of major customers...
VERMES Microdispensing today announced the opening of its own subsidiary in India, VERMES Microdispensing India Private Limited, based in the country’s IT capital, Bengaluru.
VERMES...
Green Circuits Adds Double-Sided Flying Probe
Green Circuits, Inc., a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce the addition of a Takaya Double-Sided Flying...
IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop
IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington,...
AIM to Highlight H10 at the SMTA Juarez Expo
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA...
Celanese Introduces New Micromax™ PTC085 Carbon Ink at SMTconnect 2023
Celanese will introduce an advanced Positive Temperature Coefficient (PTC) thick film ink for the growing automotive electric film heater market with its partner Alper...
Koh Young America Expands Sales Team with Two Experienced Engineers
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is pleased to announce the addition of two sales engineers to its team. Daniel...
New webinars on current topics related to manufacturing processes in the electronics industry
In May, June and July, the event calendar of Rehm Thermal Systems is filled with new webinars on numerous topics relating to the world...
New 3D solder paste inspection system with advanced technology
GÖPEL electronic presents with the new system Vario Line · 3D SPI an innovative system solution for the 3D inspection of solder and sintering...
