Largest Board AXI Platform Released by TRI

Test Research, Inc. (TRI) proudly unveils its latest innovation, the Large Board X-ray Inspection Platform, TR7600F2D QL. This cutting-edge system sets a new benchmark...

Indium Corporation Technical Expert to Present at SiP Conference China

Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging...
Malaysia Advances Semiconductor Manufacturing Footprint with CHIPX™

Malaysia Advances Semiconductor Manufacturing Footprint with CHIPX™

CHIPX™, a next-generation semiconductor and photonics manufacturer, announced plans to establish a state-of-the-art, 8-inch wafer fabrication facility in Malaysia, the first of its kind...
Indium Corporation Expert to Present on Advancing Thermal Performance at TestConX China

Indium Corporation Expert to Present on Advancing Thermal Performance at TestConX China

Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus on...

Ventec Promotes Bill Wang to Group Technical Vice President

Ventec International Group, a Taiwan Stock Exchange listed (TWSE:6672.TT) global supplier of advanced base materials for the PCB industry worldwide, has promoted Bill Wang...
Koh Young Expands Global Footprint with Grand Opening of Taiwan Office to Serve Semiconductor and Advanced Packaging Market

Koh Young Expands Global Footprint with Grand Opening of Taiwan Office to Serve Semiconductor...

Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the grand opening of its new branch office,...
Unigen Corporation

Unigen Named Contract Manufacturer of the Year by Pure Storage

Unigen Corporation has been named Contract Manufacturer of the Year (2021-2022) by Pure Storage. This exclusive honor is awarded each year by Pure to...

Nordson Electronics Solutions to Feature High-throughput Fluid Dispensing Technologies for Wafer-level and Panel-level Packaging...

Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the...

Inspection Technologies from Viscom at NEPCON Vietnam

A well-prepared team from Viscom Asia is ready to welcome visitors to NEPCON Vietnam 2023 in Hanoi. Two machines will represent the wide range...

ITW EAE Wins Best Paper of TC1 Technology Conference Presented at Nepcon China 2023

ITW EAE was selected as the winner of the best paper of TC1 Technology Conference by SMTA China East. The paper, “Selective Soldering with...