Variosystems Reinforces Engineering Leadership Team with Markus Dillinger

Variosystems plans to double its revenues by 2026 and, to make that happen, is banking on expansion, boosted employee numbers, and a broader range...

IPC Expands Presence in Malaysia, Hires New Country Manager

IPC, the global industry association for the electronics manufacturing industry, is pleased to announce the appointment of Ranee Ramya, Ph.D., as country manager for...

Experience Pioneering Manufacturing Technologies at First Hand: Rehm Thermal Systems at productronica China 2025

Since 2002, productronica in China has been one of the most important events in Asia. This year, the trade fair once again offers the...
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IPC to Host 2nd Annual Integrated Electronics Manufacturing & Interconnections (IEMI) Event

In 2022, IPC celebrated a decade of successful support to India’s electronics manufacturing industry and launched a series of activities including member networking events...
AIM Solder to Highlight New LUXTM Product Line at Hangjianet MiniLED Conference

AIM to Present on MiniLED Assembly at NEPCON Asia and SMTA South China

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming NEPCON...
Double Excellence: KONIG’s KP400 Wins Two Top Honors at NEPCON Asia

Double Excellence: KONIG’s KP400 Wins Two Top Honors at NEPCON Asia

KONIG, a leader in electronic packaging protection solutions, received two major awards on the opening day of NEPCON Asia for its breakthrough 3D Digital...
PEMTRON to Showcase Advanced Metrology and Inspection Solutions at JPCA Show 2025

PEMTRON to Showcase Advanced Metrology and Inspection Solutions at JPCA Show 2025

PEMTRON, an inspection equipment developer and supplier, today announced plans to exhibit at the JPCA Show 2025, taking place June 4–6, 2025 at Tokyo...

Saki Corporation Launches Next-Generation 3Si/3Di-EX Series for SPI & AOI

Saki Corporation, a global leader in automated inspection solutions, proudly announces the launch of its latest 3Si/3Di-EX Series of 3D Solder Paste Inspection (SPI)...

Koh Young Honored by Foxconn with 2024 Digital Ecosystem Partner Award

Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, is proud to announce that Foxconn honored us on November 15, 2024,...

PowerUP Asia 2024: Power Semiconductor Innovations Toward Green Goals

The continuous drive toward decarbonization is fueling power semiconductor innovations—whether in terms of materials, chip design, circuit topologies, or packaging. The need to improve...