NEPCON ASIA 2026 exhibition hall at Shenzhen World Exhibition and Convention Center with global electronics manufacturing exhibitors

NEPCON ASIA 2026 – Where Global Electronics Manufacturers Source Next-Gen Production Solutions

Driven by booming AI‑led innovation, advanced packaging evolution and global supply‑chain realignment, the electronics manufacturing industry is undergoing profound transformation, with Asia accounting for...
Brooks Automation to Demo PreciseFlex Collaborative Robots at NEPCON Japan 2023

Brooks Automation to Demo PreciseFlex™ Collaborative Robots at NEPCON Japan 2023

Brooks Automation will exhibit at NEPCON Japan, scheduled to take place Jan. 25-27, 2023, at Tokyo Big Sight. The company will provide demonstrations of...

Nordson Electronics Solutions to Demonstrate Popular Automated Fluid Dispensing Systems for Microelectronics Manufacturing at...

Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will demonstrate their latest solutions for semiconductor packaging and electronics manufacturing, with partner AMT...

TANAKA Establishes New Method of Recovering Precious Metals Adhering to Vacuum Film Formation Equipment...

TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Group CEO: Koichiro Tanaka), which develops industrial precious metals products as one of the core companies...

Adeptor Expands XJTAG’s Presence in Norway

XJTAG® has today announced a distribution agreement with Adeptor, a leading provider of hardware and software solutions to the electronics industry in Norway. “XJTAG is...
IPC logo

IPC to Host 2nd Annual Integrated Electronics Manufacturing & Interconnections (IEMI) Event

In 2022, IPC celebrated a decade of successful support to India’s electronics manufacturing industry and launched a series of activities including member networking events...

PowerUP Asia 2024: Power Semiconductor Innovations Toward Green Goals

The continuous drive toward decarbonization is fueling power semiconductor innovations—whether in terms of materials, chip design, circuit topologies, or packaging. The need to improve...
Fuji to Conduct R&D on High Accuracy Semiconductor Die Placement Processes Under SATAS Initiative

Fuji to Conduct R&D on High Accuracy Semiconductor Die Placement Processes Under SATAS Initiative

Fuji Corporation (headquarters: Chiryu, Aichi; Representative Director, President and CEO: Joji Isozumi; hereinafter referred to as "Fuji") has joined the Semiconductor Assembly Test Automation...

Yamaha Motor First in Japan to Use Green Steel JGreeX in Industrial Equipment

Yamaha Motor First in Japan to Use Green Steel JGreeX in Industrial Equipment. Yamaha Motor Europe announced today that it has decided to utilize JFE...

Explore PEMTRON’s Cutting-Edge Inspection Systems at the 2024 KPCA Show

PEMTRON, an inspection equipment developer and supplier, today announced plans to exhibit at the upcoming KPCA Show, taking place Sept. 4-6, 2024 in Korea....