Enics Inaugurates its First Manufacturing Site in Malaysia

Enics celebrated the inauguration of its new manufacturing site in the virtual Enics EXCELeration event on April 20th, 2021. The site located in Senai,...
Malaysia Advances Semiconductor Manufacturing Footprint with CHIPX™

Malaysia Advances Semiconductor Manufacturing Footprint with CHIPX™

CHIPX™, a next-generation semiconductor and photonics manufacturer, announced plans to establish a state-of-the-art, 8-inch wafer fabrication facility in Malaysia, the first of its kind...

Koh Young Technology Showcasing its Inspection Solutions at NEPCON ASIA in Shenzhen on November...

Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions at NEPCON Asia from November 6-8,...
Axxon-Mycronic Promotes Eric Ting to Sales Director, Southeast Asia

Axxon-Mycronic Promotes Eric Ting to Sales Director, Southeast Asia

Axxon-Mycronic, a leading, global supplier of innovative and production-ready, dispensing and conformal coating systems, is excited to announce the promotion of Eric Ting to...
Mycronic

Mycronic Receives Order for an SLX Mask Writer

Mycronic AB (publ) has received an order for an SLX mask writer from a new customer in Asia. The order value is in the...
Koh Young Appoints George Hsu to Lead Newly Opened Taiwan Office to Drive Semiconductor and Advanced Packaging Growth

Koh Young Appoints George Hsu to Lead Newly Opened Taiwan Office to Drive Semiconductor...

Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, is pleased to announce the appointment of George Hsu as...
Indium Corporation Expert to Present on AI Thermal Challenges at INEMI Forum on Complex Integrated Electronics

Indium Corporation Expert to Present on AI Thermal Challenges at INEMI Forum on Complex...

Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) with...
Fuji Succeeds in World-First 016008 mm (006003") Component Placement

Fuji Succeeds in World-First 016008 mm (006003″) Component Placement

Fuji Corporation (headquarters: Chiryu, Aichi; Representative Director, President and CEO: Joji Isozumi; hereinafter referred to as "Fuji") is pleased to announce that it has...
Concurrent forums of productronica China 2026

Concurrent Forums of productronica China 2026: Focusing on Four Cutting-edge Trends and Guiding the...

From March 25 to 27, 2026, productronica China 2026 will be held grandly at Halls E1-E5 and W1-W4 of the Shanghai New International Expo...
Indium

Indium Corporation to Showcase Innovative Materials Enabling AI Technology at SEMICON Taiwan

Indium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, AI, thin-film, and thermal management markets, will showcase its...