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CyberOptics Selected by EM Innovation Awards for New SQ3000™+ System Powered by MRS® Sensor...
CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, received a 2022 EM Innovation Award in the...
SGS To Host Power Semiconductor Device Packaging Impurity Analysis Webinar
SGS, the world’s leading testing, inspection and certification company, is hosting a complimentary webinar, ‘Power Semiconductor Device Packaging Impurity Analysis’, on Wednesday July 26,...
High Thermal Impact Reliability BGA Sphere from SHENMAO
SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile...
Top-quality Wire Bonding Connections Guaranteed Thanks to QuattroClean Snow-jet Cleaning
Ultrasonic wire bonding has been established as a contacting method in the microelectronics and semiconductor industry for many years. The technology is also ideally...
Kodiak Assembly Solutions Helps Customer Build Award-Winning Tech
Kodiak Assembly Solutions LP, a leading contract electronic manufacturer, announces that its longtime customer, NXP Semiconductors, was awarded “Best in Show” at Embedded World...
SHENMAO Offers Enhanced Solder Joint Encapsulation Material Flux
SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional...
EY Announces Dr. Subodh Kulkarni of CyberOptics Corporation as an Entrepreneur Of The Year®...
Ernst & Young LLP (EY US) announced that Dr. Subodh Kulkarni, President and CEO of CyberOptics, was named an Entrepreneur Of The Year® 2022...
Boston Semi Equipment Names Semiconductor Industry Veteran Scott Kroeger as Senior Vice President Sales...
Boston Semi Equipment (BSE) today announced that it has named Scott Kroeger as senior vice president, Sales and Marketing. He brings decades of executive...
Indium Corporation to Feature Proven Products at iMAPS SiP Conference
Indium Corporation will feature products from its portfolio of system-in-package material solutions at the Advanced System in Package Technology Conference & Exhibition, organized by...
PVA Receives Patent for New Optical Bonding Method
PVA, a global supplier of automated dispensing and coating equipment, is pleased to announce that it received a new patent in Japan for “optical...
