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IPC Issues Call for Participation for IPC APEX EXPO 2025
IPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2025. The technical conference will...
Richard Timms Joins Europlacer as International Channel Manager
Europlacer, a leading provider of SMT assembly solutions, is pleased to announce the appointment of Richard Timms as the new International Channel Manager. In...
BIMOS Announces New National Sales Manager, Ryan Crowley
Bimos, a leading provider of ergonomic ESD seating solutions, is pleased to announce the appointment of Ryan Crowley as the new National Sales Manager...
Bill Capen to Present at STAR-Light Virtual Event on July 8, Hosted by Heartland...
The Heartland SMTA Chapter has announced a follow-up to the successful STAR (Strategic Technology Advancement Research) event held in April. This new event, dubbed...
AIM Solder Promotes Chris Matthews to Business Development Manager
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the promotion of Chris Matthews to...
Cleaning and Activating Surfaces with Openair-Plasma for High-performance Electronic Products
Safe and effective cleaning of components and reduction of oxide layers, e.g. in semiconductor production or IGBT power modules, is essential for the electronics...
Heraeus Successfully Defends Patent for Metal Sintering
Heraeus Electronics GmbH & Co KG (“Heraeus”), a global leader in electronic materials and technologies, announces the successful defense of its key European patent...
KYZEN to Focus on AQUANOX A4618 and ANALYST2 at SMTA Oregon
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo & Tech Forum, scheduled to take place...
Tresky Allows Dispensing of Over 100 mm² for Large Area Sintering Applications
The integration of large-area power modules with an area of over 100 mm² is highly relevant. These modules are of great importance for various...
ASMPT Combines High-speed Chip Assembly Directly From the Wafer with SMT Placement in a...
As automotive applications, 5G and 6G, smart devices and many others require ever more compact and powerful components, advanced packaging becomes one of the...
