Printed Electronics Market to Hit $55.4 Billion by 2033: Growth 18% CAGR

Printed Electronics Market to Hit $55.4 Billion by 2033: Growth 18% CAGR

Market Summary According to latest research by Growth Market Reports, the global printed electronics market size reached USD 11.8 billion in 2024, demonstrating robust momentum driven by advances in flexible...
Libra Industries Appoints Mayur Mundra as Chief Financial Officer

Libra Industries Appoints Mayur Mundra as Chief Financial Officer

Libra Industries, a leading provider of systems integration and electronics manufacturing services (EMS), announced the appointment of Mayur Mundra as Chief Financial Officer. Mundra...
RBB Celebrates More Than 100 Years of Combined Service from Three Longstanding Engineers

RBB Celebrates More Than 100 Years of Combined Service from Three Longstanding Engineers

RBB, a trusted leader in electronics manufacturing since 1973, is proud to recognize three dedicated team members whose combined tenure with the company totals...
SMarTsol Strengthens Its Presence in the United States to Drive the High-Technology Industry

SMarTsol Strengthens Its Presence in the United States to Drive the High-Technology Industry

SMarTsol Technologies, a leading provider of technological solutions for the high-technology industry, announces the strategic expansion of its operations in the United States, reinforcing...
Poly Electronics Celebrates 10 Years of Transformation and Global Growth.

Poly Electronics Celebrates 10 Years of Transformation and Global Growth.

2026 marks a milestone year for Poly Electronics as the company celebrates 10 years of continuous growth and transformation from a regional electronics supplier...
CEA-Leti Validates First Ultra-Fast, Battery-Operated EPR Spectrometer at Chip Scale

CEA-Leti Validates First Ultra-Fast, Battery-Operated EPR Spectrometer at Chip Scale

Researchers at CEA-Leti and CEA-IRIG-SyMMES* have validated a chip-scale electron paramagnetic resonance (EPR) spectrometer that achieves unprecedented scan speed, spectral span, and sensitivity from...
Siemens Wins Best of Show Award for “Packaging: Design” at 2026 Chiplet Summit

Siemens Wins Best of Show Award for “Packaging: Design” at 2026 Chiplet Summit

Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC™ solution. The solution...
ITW EAE

ITW EAE to Feature Latest Electronic Assembly Equipment Innovations at Productronica China

ITW EAE will be showcasing its latest innovations at Productronica China, taking place March 25 - 27 in Shanghai. Located in hall E3, booth...
CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers

CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers

Researchers from CEA-List and CEA-Leti today unveiled at ISSCC  the first electro-optical router with dynamic, frame-level optical routing integrated with CMOS control logic, marking...
Inovaxe to Unveil InoHD™ Ultra-High-Density Smart Storage System at APEX 2026

Inovaxe to Unveil InoHD™ Ultra-High-Density Smart Storage System at APEX 2026

Inovaxe, a world leader and provider of innovative material handling and inventory control systems, will exhibit at the 2026 APEX EXPO, taking place March...