Heraeus announces first anniversary of Center of Excellence Singapore

Heraeus Electronics celebrates the first anniversary of its Center of Excellence for Advanced Packaging in Singapore. Equipped with state-of-the-art technologies and housing a 10k...

MiDS Signs with PDR Rework and Inspection Systems

PDR, a leading manufacturer of BGA rework systems, test and X-ray inspection systems since 1985, is pleased to announce that it signed an exclusive...

Cortec’s Top-Three Primer/Topcoat Combos for Micro-Corrosion Inhibiting Protection

Whenever time and resources allow, painters typically achieve the best coatings results from applying both a primer and a topcoat. Once this route has...

Mycronic receives order for an FPS 6100 Evo

Mycronic AB (publ) has received an order for an FPS 6100 Evo from an existing customer in Asia. The order value is in the...
indium

Indium Corporation Introduces New Hand Soldering, Rework Flux

Indium Corporation has released TACFlux® 571HF, a new no-clean, halogen-free flux formulated for both hand soldering and rework.TACFlux® 571HF joins Indium Corporation’s versatile offering...
ACT Dave Torp

ADDITIVE CIRCUITS ANNOUNCES DAVID TORP AS NEW CHIEF EXECUTIVE OFFICER

Additive Circuits Technologies LLC (“ACT”) www.additivecircuits.com is pleased to announce that effective, July 1, 2021, David Torp has been appointed as the company’s Chief...
Vector 460 Selective Soldering System

VEXOS Purchases Hentec/RPS Vector 460 Selective Soldering System to Expand Assembly Capabilities

Vector 460 offers unmatched thermal capability, rapid programming, and simplistic elegance in operation.Hentec Industries/RPS Automation is pleased to announce that VEXOS Corporation has completed...
Averatek Aluminum Over Copper

NexLogic Technologies, Inc. Implements Averatek’s Breakthrough Aluminum Soldering Process

Averatek is pleased to announce that NexLogic Technologies, Inc. has implemented soldering to aluminum using Averatek’s Mina™ chemistry. Mina™ is a breakthrough new pretreatment...
‘Wir gehen in die Tiefe’ seminar, 2019 (image: Rehm Thermal Systems)

Face-to-face events again at last!

Rehm Thermal Systems to appear at the EPP InnovationsFORUM and ‘Wir gehen in die Tiefe’ They’re back. The first face-to-face events for a long time...
Viscom traditionally took the main moderation into its own hands: Overall Sales Manager Torsten Pelzer and Head of Key Account Management Dr. Nicolas Thiemeyer shortly before an interim summary

Viscom Takes Positive Stock After Online Event

Now firmly established in the electronics industry, the Viscom Technology Forum impressed everyone this year for the first time as a completely digital Internet...