Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will exhibit at the 2026 APEX EXPO, taking place March 17-19 at the Anaheim Convention Center, where the company will showcase inspection, routing, cleaning, and materials management technologies for electronics manufacturing.
In Booth 1434, Seika will feature live demonstrations and displays of equipment from leading global suppliers, including:
- Sayaka CT56XJ Router – A high-speed PCB depaneling router designed for large-format boards, offering precise cutting with minimal stress to components and support for traceability and automated operation.
- Sawa T100 Automatic Aperture Inspection System – Provides fast, automated inspection of stencil apertures to support print quality and process consistency.
- Sawa EcoBrid Cleaner – An upgraded model with even faster tact time of 3 minutes, cleaning and drying. Also, only 40cc of solvent is used per stencil for cleaning. This environmentally conscious cleaning solution is designed to reduce chemical use while maintaining effective cleaning performance.
- NLT N1 Checker – Inspection solution supporting quality control and defect detection in electronics assembly processes.
- Hitachi Giken Systems – Advanced inspection and manufacturing solutions designed for high-reliability electronics production.
- Malcom Process Control Equipment (6 ft. table) – Featuring a new viscometer and new solder paste mixer for improved materials consistency and process monitoring.
- Unitech Cleaner – Designed to accommodate large board sizes, supporting thorough cleaning for demanding applications.
- McDry MB-302A Dry Cabinet – Compact dry storage for moisture-sensitive devices.
- McDry DXU-1001A Dry Cabinet – Advanced dry storage featuring an integrated data logger and reel rack for traceable component management.
- Moritech EMC Scanner WM7000 (6 ft. table) – Electromagnetic compatibility scanning system for pre-compliance testing and diagnostics.
- Kyowa Sampling Moiré Camera (DSMC-100A) – A non-contact 3D measurement system used for warp, strain, and deformation analysis, supporting precision inspection in electronics manufacturing.
Seika Machinery will have technical experts available throughout the event to discuss applications, process challenges, and system integration across SMT, inspection, and materials handling workflows.
Attendees are invited to visit the Seika Machinery exhibit to see these solutions firsthand and learn how they support quality, reliability, and efficiency in electronics manufacturing.
For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com.
