Solderstar LLC, a leading provider of thermal profiling solutions for the electronics manufacturing industry, will exhibit its latest process control innovations at SMTA International 2025, held at the Donald E. Stephens Convention Center in Rosemont, Illinois from 19-23 October.
The exhibition will feature Solderstar’s newest Reflow Shuttle O₂, designed for nitrogen-assisted reflow soldering processes. The measurement module provides zone-by-zone oxygen analysis in parts per million (ppm) alongside temperature profiles, three-axis vibration, conveyor speed, and optional vacuum measurements.
Equipped with the Smartlink system, the Reflow Shuttle O₂ connects to an SLX thermal profiler to quickly capture and record process data. Advanced sensors measure top and bottom heater performance and temperature uniformity across the heated zone. Three-axis vibration and optional vacuum measurements provide insight into conveyor and process anomalies, with vacuum monitoring capturing hold times and pull down/release rates to prevent component shift. This monitoring enables manufacturers to identify issues quickly and optimize nitrogen usage without disrupting production
Alongside the Reflow Shuttle O₂, Solderstar will showcase the SLX ultra-compact thermal profiler, featuring a versatile data logger compatible across multiple soldering applications. The SLX offers quick setup with minimal user input, automatic configuration when docked onto SMARTLink heatshields or other accessories, optional 2.4 GHz telemetry, and extended battery life with minimal downtime, supporting long-duration profiling across production lines. These capabilities enable high-precision, data capture across demanding production environments.
Keith Blakley, Sales Manager at Solderstar, said: “SMTAi is one of the most important events for the electronics community, bringing together manufacturers focused on improving production processes. We’re looking forward to welcoming visitors to our booth to discuss the challenges they face and share how Solderstar’s profiling solutions can provide practical insights to improve process control, reduce defects, and enhance efficiency and traceability across their operations.”
Solderstar will offer technical discussions and guidance at its booth, giving visitors practical insight into optimizing soldering processes and improving operational outcomes. Visit Solderstar at Booth 2416, SMTA International 2025, Donald E. Stephens Convention Center in Rosemont, Illinois, from 19-23 October.
