SHENMAO TECHNOLOGY is pleased to introduce SMF-WC58, a water-soluble, halogen-free tacky flux developed for ultra-fine bump pitch flip-chip and BGA/CSP attach processes.
SMF-WC58 provides strong wettability across a wide range of pad finishes, including Bare Cu, Cu-OSP, NiAu, ENEPIG, and ImSn. It also delivers long work life—12 hours or more—and leaves residues that can be easily removed with deionized (DI) water after reflow, helping manufacturers simplify cleaning steps.
Key Features of SMF-WC58:
- Halogen-free (ORH0); compliant with RoHS, RoHS 2.0, and REACH.
- Excellent wettability on common pad finishes.
- Suitable for flip-chip and BGA/CSP applications.
- Compatible with printing, transfer, and dipping.
- Extended work life (≥ 12 hours).
- Cleanable with DI water after reflow.
“SMF-WC58 is designed to make high-density packaging more reliable and easier to manage,” said Kelvin Li, General Manager of SHENMAO Group. “It combines stable performance with a straightforward cleaning process, which is a big advantage for production environments.”
SHENMAO continues to expand its portfolio of soldering materials to support the needs of advanced packaging and next-generation electronics.
To learn more about SHENMAO’s high-performance solder materials, visit www.SHENMAO.com.
