Intersurface Dynamics (IDI), a subsidiary of Amtech Systems, Inc. and a manufacturer of application-specific chemistries for semiconductor manufacturing, today announced the introduction of Candeo™, a next-generation post-CMP cleaning solution designed to significantly reduce defectivity, increase total usable wafer area, and improve process consistency.
Candeo™ is engineered to address one of the most critical challenges in advanced semiconductor manufacturing—removal of residual particles and ionic contamination following CMP. By delivering improved cleaning performance compared to conventional ammonium hydroxide (NH₄OH) based processes, Candeo™ enables higher yield and enhanced device reliability across a range of applications, including silicon, silicon carbide (SiC), and advanced packaging.
“Candeo™ reflects our focus on solving real customer process challenges with targeted chemistry innovation,” said Peter Wrschka Ph.D., Business Unit Director, Amtech Systems. “By reducing post-CMP defectivity and increasing usable wafer area, we are helping customers directly improve yield, lower cost per wafer, and meet increasingly demanding device requirements,” added Wrschka.
The formulation provides a wider, more forgiving process window, enabling stable, repeatable results across varying process conditions. In addition, Candeo™ offers a favorable environmental and operational profile, as a low-impact chemistry that is safe for discharge and free of the strong odors commonly associated with legacy cleaning solutions.
Candeo™ has been specifically developed for compatibility with Entrepix cleaning platforms, including the DSS-200, enabling straightforward integration into existing process flows without the need for hardware modifications. This compatibility supports rapid evaluation and deployment in both development and production environments.
To further accelerate adoption, Candeo™ has been validated through real-world process testing at the Entrepix CMP Foundry, where customers can perform head-to-head benchmarking against incumbent chemistries. This capability enables faster process optimization, reduced qualification risk, and a more direct path to high-volume manufacturing.
Candeo™ is available for evaluation and process development through Intersurface Dynamics and Entrepix.
To learn more, visit www.isurface.com.
