AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Guadalajara Expo & Tech Forum taking place September 11 and 12 at Expo Guadalajara Salón Jalisco Hall D & E, Guadalajara, Jalisco Mexico. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
In addition, AIM Technical Support Engineer David Solis will be giving a presentation titled Addressing Challenges and Solutions for M0201, 008005 and Micro/MiniLEDs:
The use of ultra-miniature components is driven by the demand for increased functionality in electronic devices. SMT components such as 008004/M0201 are being used in consumer and automotive applications today. Similarly, MiniLED components are finding their way into displays available in the market. Manufacturers are creating new PCB designs, using novel assembly techniques, and introducing innovative materials to overcome the unique challenges faced when implementing these components. This presentation will discuss the new information on how to overcome the challenges faced in ultra-miniature component assembly and address the needs of emerging markets.
To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Guadalajara Expo & Tech Forum at Booth 110 September 11-12th, or visit www.aimsolder.com.
