The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, has received ‘The Best Presentation of Technology Conference Two’ award for the technical paper: “Can All Liquid Fluxes Work Well on A Reflowed OSP Pad Finish?” presented at the SMTA China East Technical Conference 2021 in Shanghai.

The topic “Can All Liquid Fluxes Work Well on A Reflowed OSP Pad Finish?” was presented by William Yu, Senior Technical Services Manager for MacDermid Alpha Northern China. The presentation investigated the chemical changes OSP coating undergoes in thermal excursions. Elements of soldering flux that may neutralize the effect of such degradation were short-listed. The wetting property of lead-free solder on thermally exposed OSP was then studied in the presence of these elements and the soldering fluxes containing them.

As the Senior Technical Service Manager for MacDermid Alpha Electronics Solutions – Assembly Division, William Yu provides technical and applications support to a vast array of customers in mainland China. He has worked within the SMT Industry for more than 20 years.

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About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester and MacDermid Enthone brands, we provide solutions that power electronics interconnection.  We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at