Essemtec PUMA Ultra and FOX Ultra All-in-One SMT manufacturing platforms on display at NEPCON ASIA 2026

Essemtec to Showcase Advanced All-in-One Manufacturing Solutions for SMT and Advanced Packaging at NEPCON...

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Essemtec, a global leader in adaptive SMT manufacturing solutions, will participate in NEPCON ASIA 2026, taking place from October 27-29, 2026, at the Shenzhen...
SAKI 3Di-LS3BX inline 3D bottom-side AOI system for THT solder joint and full-surface PCB inspection

SAKI Launches New Inline 3D Bottom-Side AOI System

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SAKI Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce the launch of its new 3Di-LS3BX...
Koh Young Technology inspection systems and AI-powered solutions on display at NEPCON Asia 2026 in Shenzhen

Koh Young to Unveil Next-Generation Inspection and Smart AI Solutions at NEPCON Asia 2026

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Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will unveil its latest inspection platforms and AI-powered process solutions at NEPCON...
Fuji NXTR SMT pick and place machine performing placement of Broadcom Tomahawk 6 Davisson CPO Ethernet switch component

Fuji Achieves Industry-First Placement of Broadcom’s Tomahawk® 6 – Davisson

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Fuji Corporation (headquarters: Chiryu, Aichi; Representative Director, President and CEO: Joji Isozumi; hereafter referred to as "Fuji") conducted an SMT placement evaluation of Broadcom's...
KYZEN's new Southeast Asia Headquarters building and production facility in Penang, Malaysia

KYZEN Opens New Penang Office to Continue Success in Malaysia

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KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce the opening of the company's new Southeast Asian Headquarters building...
LPKF NEXAR LIDE laser glass processing system for advanced semiconductor packaging production

Leading Asian Advanced Semiconductor Packaging Manufacturer Selects LPKF’s Glass Processing Equipment for Production Ramp-Up

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LPKF Laser & Electronics SE has received a letter of Intent (LOI) for the purchase of NEXAR LIDE systems from a leading Asian advanced...
Ryder Industries new Vietnam manufacturing campus with four buildings and 38,000 square metres of floor area

Ryder Industries Expands Vietnam Manufacturing

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Electronics manufacturing services provider, Ryder Industries is expanding its manufacturing operations in Vietnam with a new production facility that will increase its capacity in...
NEPCON ASIA 2026 electronics manufacturing exhibition at Shenzhen World Exhibition and Convention Center

Explore the Latest Electronics Manufacturing Technologies and AI-powered Transformation this October at NEPCON ASIA

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NEPCON ASIA 2026, Asia's leading electronics manufacturing exhibition, will take place October 27–29, 2026, at Shenzhen World Exhibition & Convention Center (Shenzhen World, Bao'an)....
New ICTC Philippines manufacturing facility at Laguna Technopark Inc. Phase 7, Binan, Laguna, Philippines

ICTC Philippines Expands Manufacturing Capabilities with New Facility in Laguna

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Interconnect Cable Technologies Corporation (ICTC), a global contract manufacturer, is proud to announce that ICTC Philippines has reached a significant milestone with the opening...
Yole Group and MSIA executives presenting semiconductor market intelligence at SMC2026 Executive Masterclass in Penang

Advanced Packaging Takes Centre Stage as AI reshapes the Semiconductor Value Chain

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As artificial intelligence reshapes semiconductor architectures and accelerates demand for advanced packaging, Yole Group and the Malaysia Semiconductor Industry Association (MSIA) will bring global...
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