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Connecting Electronics with Power, Mobility, and Future Energy Systems: Thailand Electronics Circuit Asia 2026
Taking place on 26–28 August 2026 at BITEC, Bangkok, THECA 2026 will bring together over 300 exhibitors and 7,000+ professionals from more than 40...
Shenzhen SAM Electronic Equipment to Present PCB, SMT and Semiconductor Cleaning Solutions at JPCA...
Shenzhen SAM Electronic Equipment Co., Ltd. will exhibit at the JPCA Show 2026, taking place June 10-12 in Tokyo, Japan. Visitors are invited to...
AIM Hires Marcus Pee as Sales Engineer for Southeast Asia
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Marcus Pee Nai...
Introducing the CLT-FG, a New Series of Compact All-in-One Placement Machines
Fuji Corporation (headquarters: Chiryu, Aichi; Representative Director, President and CEO: Joji Isozumi; hereinafter referred to as "Fuji") has developed a new placement machine, the...
World’s First! Announcing the Auto Kitting Station, a New Unit Automating the Tape Reel...
Fuji Corporation (headquarters: Chiryu, Aichi; Representative Director, President and CEO: Joji Isozumi; hereinafter referred to as "Fuji") has developed a new unit, the Auto...
NGK to Increase Production Capacity of Ceramics for Semiconductor Manufacturing Equipment
NGK Corporation (hereinafter, “NGK”) today announced that it has decided to establish a new production site for ceramics for semiconductor manufacturing equipment in Nomi...
Yamaha Motor Opens Sales and Service Facility for Robotics Business in Gurugram, India
Yamaha Motor has opened the Robotics Business Support Division as a sales and service facility for its robotics business in Gurugram, Haryana, India. The...
Essemtec to Showcase Advanced Dispensing, Jetting and Hybrid Packaging Solutions at NEPCON Shanghai 2026
Essemtec, a global leader in adaptive SMT manufacturing solutions, will participate at NEPCON Shanghai 2026, taking place from June 2–4, 2026, in Shanghai, China....
Pushing Limits: Indium Corporation to Present on Metal TIMs Solutions for Demanding Thermal Environments...
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how metal thermal interface materials (TIMs) can unlock the full performance potential of next-generation...
Embodied Intelligence Era Arrives, ROBOTECH ASIA Makes a Debut at NEPCON ASIA 2026
Booth bookings are now open for NEPCON ASIA 2026, Asia’s leading electronics manufacturing exhibition, set for Oct. 27–29 at the Shenzhen World Exhibition &...
