The Asian electronics manufacturing industry is once again turning its attention to Shanghai, as productronica China 2026 is set to take place at the...
CHIPX™, a next-generation semiconductor and photonics manufacturer, announced plans to establish a state-of-the-art, 8-inch wafer fabrication facility in Malaysia, the first of its kind...
NGK INSULATORS, LTD. (hereinafter, “NGK”) will triple its production capacity for the Translucent Alumina Wafer by fiscal 2027 to meet growing demand for chiplet...
As NEPCON JAPAN approaches its 40th anniversary, RX Japan is gearing up to host an expert-led conference programme, packed with the leading voices from...
Indium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will...
PEMTRON, an inspection equipment developer and supplier, will exhibit at SEMICON Japan 2025, taking place December 17–19 at Tokyo Big Sight. Visitors can find...
KONIG, a leader in electronic packaging protection solutions, received two major awards on the opening day of NEPCON Asia for its breakthrough 3D Digital...
Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, has appointed Jeff Lee as Head of Industrial Solutions Business....
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that its ANALYST² Process Control System has won a 2025...
One of the world’s largest showcases of advanced material technologies, Highly-Functional Material Week Tokyo 2025, will open its doors at Makuhari Messe on November...