Modular Platform with Epoxy Bonding, Laser Welding, and Selective Laser Soldering for Hybrid Optoelectronic Components

Modular Platform with Epoxy Bonding, Laser Welding, and Selective Laser Soldering for Hybrid Optoelectronic...

The assembly of optoelectronic components requires maximum precision and permanently stable connections. With NanoHybrid, nanosystec offers a modular platform that combines epoxy bonding, laser...
Emil Otto meets high demand for ROL0 fluxes

Emil Otto Meets High Demand for ROL0 Fluxes

Fluxes classified as ROL0 fluxes contain colophonium as a resin component. The new flux series EO-B-026 A - C are ROL0 fluxes of the...
SEHO Systems Strengthens Its Position in India with NMTronics Partnership

Heller Industries Inc. and SEHO Systems GmbH Announce Strategic Partnership to Strengthen Global Presence

Heller Industries Inc. and SEHO Systems GmbH have entered into a strategic partnership aimed at strengthening their global market position and leveraging their complementary...
accu-assembly

Accu-Assembly Inc. Paving the Way in Industrial Automation for 25 Years

Accu-Assembly Inc., a leading industrial automation company, is please to announce its 25-year anniversary. Founded in 1997, Accu-Assembly is dedicated to providing automation, quality...
Nordson TEST & INSPECTION Receives Global Technology Award for Assure FLEX E Component Counter

Nordson TEST & INSPECTION Receives Global Technology Award for Assure FLEX E Component Counter

Nordson TEST & INSPECTION, a division of the Nordson Corporation, received a 2022 GLOBAL Technology Award in the category of ID Systems / Component...
Molex

Molex Announces Agreement to Acquire Teramount Ltd to Accelerate Scalable Co-Packaged Optics Adoption

Molex, a global electronics leader and connectivity innovator, today announced an agreement to acquire Teramount Ltd., an Israel-based developer of detachable fiber-to-chip connectivity solutions...
SMTA

Virtual Program Announced for International Conference for Electronics Hardware Enabling Technologies (ICEHET)

The SMTA is pleased to announce the International Conference for Electronics Hardware Enabling Technologies (ICEHET) is scheduled 2-3 June 2021 as an express virtual...
Seica at smtconnect

SEICA – SMT Connect Nuremberg Preview

Automation and Smart Factory go hand in hand, and visitors to Seica’s booth 4A-120 at SMT in Nuremberg will be able to see leading-edge solutions that check all of...

Michael Zahn Joins Koh Young Europe as Sales Manager

Koh Young Europe GmbH is pleased to announce that Michael Zahn has joined the world leader in measurement-based True3D inspection systems. With years of...
YINCAE advanced materials for AI, HPC, silicon photonics and semiconductor packaging displayed at SEMICON West 2026

YINCAE Shows Innovative Materials to SEMICON West 2026

YINCAE will showcase its latest materials for AI, high-performance computing (HPC), silicon photonics, optical interconnects, thermal management, and advanced semiconductor packaging at SEMICON West...