Murray Percival Co. Can Improve Your Process with On-Site-Gas

Murray Percival Co. Can Improve Your Process with On-Site-Gas

The Murray Percival Company, the award-winning leading supplier to the Midwest's electronics industry, is pleased to announce that they assisted yet another customer process...

Nidec to Execute a Share Transfer Agreement on Linear Transfer Automation Inc. and its...

Nidec Corporation (TSE: 6594; OTC US: NJDCY) (the “Company” or “Nidec”) announced today that its Board of Directors has approved a resolution to acquire...

YINCAE Launches Diamond Underfill UF 158D with 8 W/m·K Thermal Conductivity

YINCAE, a leader in advanced electronic materials, has introduced Diamond Underfill UF 158D, delivering 8 W/m·K thermal conductivity—a new standard in heat dissipation for...
AIM to Highlight NC259FPA Ultrafine Solder Paste & Present on Low Temp Solder at IPC APEX 2024

AIM to Highlight NC259FPA Ultrafine Solder Paste & Present on Low Temp Solder at...

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming IPC...
Cetec ERP to Exhibit Manufacturing Software at Design-2-Part in Irving, TX

Cetec ERP to Exhibit Manufacturing Software at Design-2-Part in Irving, TX

Cetec ERP will exhibit at the Design-2-Part Show in Texas at the Irving Convention Center, scheduled to take place April 9-10, 2025, showcasing its...
Murray Percival Co.

The Murray Percival Company Partners with Kester to Deliver Enhanced Value to Customers

The Murray Percival Company, the award-winning leading supplier to the Midwest’s electronics industry, is proud to announce its partnership with Kester, a leading global...
Live VIRTUAL Advanced Electronics Assembly Conference

Live VIRTUAL Advanced Electronics Assembly Conference

The SMTA is pleased to announce the Live VIRTUAL Advanced Electronics Assembly Conference taking place online 29 November, 2022 from 8:00am-1:00pm (GMT). The Advanced...
KOKI Announces Upcoming Webinar on a Residue-Free Soldering Solution for Power Devices Using Formic Acid Reflow

KOKI Announces Upcoming Webinar on a Residue-Free Soldering Solution for Power Devices Using Formic...

KOKI, a global leader in advanced soldering materials and process optimization services, will host a free, live webinar on Thursday, May 29, 2025, at...
Nordson Test & Inspection Launches Advanced Inspection and Metrology Solutions at Productronica & SEMICON Europa 2025

Nordson Test & Inspection Launches Advanced Inspection and Metrology Solutions at Productronica & SEMICON...

Nordson TEST & INSPECTION today announced plans to exhibit with distributor partners at Productronica and SEMICON Europa, scheduled to take place November 18-21 at...

UF 120LA: The Next-Generation High Reliability, 100% Flux Residue Compatible and Reworkable Underfill

YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates...