PICMG Bolsters New COM-HPC “Mini” Form Factor with Release of Carrier Design Guide Revision...

PICMG®, a consortium for open hardware specifications, has released revision 2.2 of the COM-HPC® Carrier Design Guide. This comprehensive document contains interface schematics, diagrams,...
STI Electronics, Inc. Hires Cesar Santos as Kit Room Associate

STI Electronics, Inc. Hires Cesar Santos as Kit Room Associate

STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping and contract PCB assembly, announces that Cesar Santos has joined...

SEHO and Lean Stream Start Strategic Partnership

SEHO North America, Inc., a worldwide leading supplier of complete solutions for soldering processes and automated production lines, is proud to announce a new...

Naprotek Announces Appointment of Teh-Kuang Lung as President & CEO

Naprotek, LLC, a leading provider of mission-critical electronics technology solutions, is excited to announce the appointment of Teh-Kuang Lung as its new President and...
Saelig Introduces Permaflow® Clamp-on, Non-Invasive Transit Time Ultrasonic Flow Meter

Saelig Introduces Permaflow® Clamp-on, Non-Invasive Transit Time Ultrasonic Flow Meter

Saelig Company, Inc. has introduced the Coltraco Permaflow® Ultrasonic Transit-time Flow and Heat Meter, which uses a pair of clamp-on ultrasonic transducers to non-invasively monitor...

Ventec to Launch New Bondply Dielectrics and Value-Added Services at IPC APEX 2024

Ventec International Group is to reveal new products for advanced signal integrity and thermal performance, and introduce services, during IPC APEX Expo 2024, April...
The Fastest Easiest way to Improve Component Storage with Scienscope

The Fastest Easiest way to Improve Component Storage with Scienscope

Scienscope International, a leading American supplier of cabinet-style micro-focus X-ray systems, is offering 50 percent off the purchase of one Smart Storage Rack for...
Hyundai Mobis Acquires Stake in U.S. Fabless Semiconductor Company for Electric Vehicle Applications

Hyundai Mobis Acquires Stake in U.S. Fabless Semiconductor Company for Electric Vehicle Applications

Elevation Microsystems, delivering energy-efficient high-voltage power management solutions for sustainable electrification, backed by expertise in automotive power system architecture, functional safety, and advanced design,...

Vayo Technology’s DFX Execution System Accelerates Enterprise Digital Transformation at PCB West 2023

Vayo Technology, a global provider of industrial software solutions for interconnected electronic systems from design to manufacturing, is pleased to announce plans to exhibit...
Arch Systems Named a Cool Vendor in the 2025 Gartner® Cool Vendors™

Arch and Jabil Build on Past Success and Expand Strategic Collaboration to Deliver AI-Guided...

Arch Systems, a leader in manufacturing data and AI solutions, today announced an expanded and unique strategic collaboration with Jabil Inc., a leading engineering,...