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Wafer-Level Packaging Symposium (WLPS) Program Announced and Registration Now Open
The SMTA is pleased to announce the technical program for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 15-17, 2022 at...
Critical Manufacturing to Showcase Latest MES for Electronics Assembly in ASMPT Booth at APEX
Critical Manufacturing today announced that it will exhibit with technology leader, ASMPT, at the 2022 IPC APEX EXPO (to be held at the San...
Electrolube Launch New Bio Coatings and Gap Fillers at IPC APEX EXPO
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design...
AI-powered Inspection Solutions from TRI at SEMICON Taiwan 2021
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join NEPCON Asia held at Taipei Nangang...
Current Conditions for the Electronics Supply Chain Remain Challenging
IPC has issued two new industry intelligence reports today: the December sentiment of the global electronics manufacturing supply chain report and the December economic...
UP MEDIA GROUP ISSUES CALL FOR ABSTRACTS FOR PCB WEST 2022
UP Media Group Inc. seeks abstracts for its annual PCB West technical conference coming in 2022.
PCB West will be held October 4 to 7,...
Winners of IPC Hand Soldering Competition at productronica in Munich, Germany Announced
In cooperation with productronica 2021, IPC hosted the popular Hand Soldering Competition (HSC), on November 16-19. Skilled competitors demonstrated their expertise in hand soldering while...
STI Electronics, Inc.’s David Raby Receives Founder’s Award from SMTA
STI Electronics, Inc., a full-service organization including engineering, contract manufacturing, training services and training materials, announced that President/CEO David Raby received the Founder’s Award...
North American PCB Industry Sales Up 6 Percent in October
IPC announced today the October 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.15.
Total North American...
New Study Finds Semiconductor Supply Chain Will Remain Vulnerable Without Robust Federal Investment in...
A new study about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen domestic...
