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QP Technologies™ Achieves ANSI/ESD S20.20 Certification
QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has been certified ANSI/ESD S20.20-compliant by TÜV SÜD America...
Indium Corporation Earns New Product Introduction Award for Low-Voiding, Pb-Free Solder Paste
Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its low-voiding, Pb-free solder paste, Indium8.9HFRV. The award was presented at...
Effective Solder Masks: The Key to Optimized Soldering Processes
The Family-owned company Leutz Lötsysteme GmbH specializes in the development, design and production of soldering systems. Based in Albershausen, Baden-Württemberg, the experts have been...
Aegis Software and JUKI Extend Reseller Relationship, Marking Over 23 Years of Collaboration
Aegis Software, a global provider of Manufacturing Execution System (MES) software, announces that JUKI Automation, a world-leading provider of automated assembly products and systems...
IPC Honors Summit Interconnect and Robert Bosch GmbH with Corporate Recognition Awards
IPC presented its highest corporate honors to two IPC member companies, Summit Interconnect and Robert Bosch GmbH during the IPC Annual Meeting/Awards Ceremony at...
Data I/O Announces Major Milestone with 500th PSV System Sale Ahead of IPC APEX...
Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced security and data deployment solutions for microcontrollers, security ICs and memory devices, announced...
Seika Machinery Recognizes Outstanding Sales Achievements at 2024 IPC APEX EXPO
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, proudly presented its prestigious sales awards during its sales training meeting...
TE Connectivity Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that TE Connectivity has finalized...
Indium Corporation to Host Free Webinar on Lead-Free Solder Paste for Automotive Applications
Indium Corporation’s Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications. The webinar, part...
DuPont Unveils Pyralux® ML Laminate Series, Offering High Thermal Management for Extreme Environments
DuPont today introduced the DuPont™ Pyralux® ML Series of double-sided metal-clad laminates, a unique addition to its extensive family of Pyralux® laminates for flexible...
