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Wiring the World Together: IPC and WHMA Unveil Global Wire Harness Competitions and Championship
IPC, in collaboration with the Wiring Harness Manufacturer's Association (WHMA), has organized the first-ever World Wire Harness Competitions and Championship. Regional country competitions will...
Vayo Technology’s DFX Execution System Accelerates Enterprise Digital Transformation at PCB West 2023
Vayo Technology, a global provider of industrial software solutions for interconnected electronic systems from design to manufacturing, is pleased to announce plans to exhibit...
New structural adhesive offers temperature stability four times that of other adhesives in its...
DELO has launched an adhesive with exceptionally high temperature stability. DELO MONOPOX HT2999 achieves strengths of 20 MPa at 180 °C. This is four...
Siemens Wins Best of Show Award for “Packaging: Design” at 2026 Chiplet Summit
Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC™ solution. The solution...
StenTech’s Photo Stencil Specialized Products Division Facility Update Completed!
StenTech® Inc., a leading global company specializing in SMT Printing Solutions, has completed a major technology update to their Photo Stencil Specialized Products Division...
Justin Cody Worden/Austin American Technology to Guest Host Exclusive Interviews at SMTA International 2023
Austin American Technology (AAT) is proud to announce its pivotal role as a key sponsor for the on-camera interviews conducted by Justin Cody Worden...
Saki Receives NPI Award 2023 for Innovative 3D-AOI 3Di Series Solution
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, has been awarded a New Product Introduction (NPI) Award 2023...
INEMI Publishes Roadmaps for Board Assembly and Complex Integrated Systems and Expands PCB Roadmap...
The International Electronics Manufacturing Initiative (INEMI) has published content on three new roadmap topics in key areas of electronics systems: board assembly, complex integrated...
Symposium on Counterfeit Parts & Materials Program Finalized
The SMTA is pleased to announce the technical program for the Symposium on Counterfeit Parts & Materials. Co-organized by SMTA and the Center for...
Solderstar to Present Advanced Reflow Profiling Solution at SMTA International 2024
Solderstar, a leader in innovative profiling solutions for the electronics manufacturing industry, is exhibiting at the SMTA International 2024 conference in Rosemont, Illinois, booth...
