The die-to-die bonding process Thermosonic Bonding (TSB) combines the novel thermocompression bonding with ultrasonic welding (UW).
Ultrasonic welding can reduce bonding pressure and temperature. This...
ITW EAE, a leading manufacturer of high-performance equipment for the electronics assembly and thermal processing industries, is pleased to announce the promotion of Joy...
Viscom AG continues its success story in the field of manual and automated X-ray inspection (3D-MXI) with a new high-quality system: like its predecessor...
Europlacer, the global leader in flexible SMT assembly solutions, has appointed Craig Brown as Sales Director for Europlacer Americas, effective October 6, 2025.
Brown...
Growth-orientated electronics manufacturing services (EMS) provider, ESCATEC, intends to maximise operational efficiencies with the appointment of industry expert Alessandro Marinai as its new Chief...
Luminovo, the number one quoting, procurement and collaboration software for the electronics supply chain, is excited to announce its upcoming live webinar, “From BOM...
SHENMAO Technology is proud to commemorate its 50th anniversary. Founded in 1973, SHENMAO has witnessed the evolution of Taiwan’s electronics industry, playing a pivotal...
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is pleased to announce that it will exhibit at NEPCON Asia from Oct. 20-22,...
PVA, a global supplier of automated dispensing and coating equipment, is excited to announce its participation in the upcoming SMTconnect exhibition, scheduled to take...