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Modular Platform with Epoxy Bonding, Laser Welding, and Selective Laser Soldering for Hybrid Optoelectronic...
The assembly of optoelectronic components requires maximum precision and permanently stable connections. With NanoHybrid, nanosystec offers a modular platform that combines epoxy bonding, laser...
Astranis Space Technologies Corp Orders Hentec Industries/RPS Automation Odyssey Component Lead Tinning System
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Astranis Space Technologies Corp...
Auxo Investment Partners Strengthens Growing Wire Harness and Cable Manufacturing Platform with the Acquisition...
Private investment firm Auxo Investment Partners announced today that it has acquired SOS Manufacturing, a manufacturer of specialized wire harnesses, cable assemblies and complete...
Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC
Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly...
Hentec/RPS Publishes Achieving Greater Through-Hole Soldering Reliability Tech Paper
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing...
MacDermid Alpha to Promote High Reliability Assembly Solutions at EMS-Tag, Germany
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will exhibit its range of innovative assembly...
Koh Young Neptune C+ Wins Prestigious Global Technology Award for Best Test Inspection during...
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is excited to announce Global SMT & Packaging recognized the new Neptune C+ for...
New to the Market: Light-Curable Materials for Consumer Electronics Wearable Devices
Dymax, a leading manufacturer of rapid-curing materials and equipment, is pleased to release its 9200-W series of next-generation light-curable encapsulants and structural and optical-positioning...
Murray Percival Co. Offers Nordson Assure to Improve Customers’ Efficiency
The Murray Percival Company has announced another successful installation of a Nordson Assure Component Counter to a satisfied customer within its Midwest territory. The...
Enabling Technology will Transform PCB Assemblies
The Occam Group’s (TOG) game-changing solderless assembly technology will reorder the way electronic components are assembled, greatly improving reliability and performance, while significantly reducing...
