New Anti-HoP Lead-Free Solder Paste Developed to Prevent HoP Issues

New Anti-HoP Lead-Free Solder Paste Developed to Prevent HoP Issues

SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow...
Karl Pfluke Mcdermid alpha

MacDermid Alpha Electronic Solutions Announces New District Sales Manager for Southeast United States Region

MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design...
HARTING expands SPE infrastructure range

HARTING Expands SPE Infrastructure Range

HARTING has launched an expanded range of products to support and boost its Single Pair Ethernet (SPE) infrastructure. Semiconductor PHY chipsets, magnetics, cable and...
IPC Issues Call for Participation for IPC APEX EXPO 2026

IPC Issues Call for Participation for IPC APEX EXPO 2026

IPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2026. The technical conference, reimagined...
ALPHA OM 220

MacDermid Alpha Launches New Ultra-Low Temperature Solder Paste capable of Soldering Heat-Sensitive Components

MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release of ALPHA OM-220, its latest innovation in low-temperature solder...

GEN3’s Graham Naisbitt Speaks with Nolan Johnson on the Crucial Topic of Objective Evidence...

GEN3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, proudly announces the recent interview of Graham Naisbitt, President of GEN3,...
Rod Kasperson, PVA at productronica: Showcasing Gold-Standard Dispensing Technology

PVA at productronica: Showcasing Gold-Standard Dispensing Technology

PVA (PVA.net) will showcase its signature dispensing and conformal coating equipment and technology at productronica 2025, to be held at Messe München Fairgrounds in...
Naprotek Appoints Tim Filteau as Chief Executive Officer

Naprotek Appoints Tim Filteau as Chief Executive Officer

Naprotek, a leader in technology solutions driving digital transformation, announced the appointment of Tim Filteau as its new Chief Executive Officer. This strategic leadership...
IPC logo

Electrical Wire Processing Technology Expo (EWPTE) Named in Trade Show Executive’s Top 100 List...

Registration is now open for Electrical Wire Processing Technology Expo (EWPTE) an exclusive, free-of-charge* event for the electrical wire harness, wire, coil winding and...
Indium

Indium Corporation Powering Sustainability at APEC 2025

As one of the leading materials providers in the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability...