From November 14 to 17, ASMPT presents its solutions at the productronica in Munich, the world’s leading trade fair for electronics development and production. The global innovation and market leader in the field of semiconductor and SMT manufacturing exhibits its semiconductor solutions at booth A3.377 under the motto “Smart Automotive Solutions”.
Two machines will be of special interest for makers of automotive electronics: ASMPT will present one of the most advanced die bonding systems currently available with the new version of the AMICRA NOVA Pro, and the AEi CMAT-S is a complete system for the assembly and dynamic alignment of lenses in ADAS cameras.
The AMICRA NOVA Pro is aimed at manufacturers who want to upgrade their lines in the areas of optoelectronics and advanced packaging. The die-bond- and flip-chip-capable machine features highest accuracy in the one-micron range along with high throughput (1,000 UPH) for applications such as the production of active optical cables for 400/800 Gigabit/sec networks. It achieves its high placement accuracy with features such as high-resolution optics and innovative technologies that compensate for vibrations in the machine. The AMICRA NOVA Pro has been nominated for the productronica Innovation Award.
Better cameras, faster production
Another contender for the productronica Innovation Award is the AEi CMAT-S. This cutting-edge solution revolutionizes camera assembly throughput, boasting an impressive two-fold increase over competing equipment in the market. What sets it apart is its ability to deliver such remarkable results while maintaining the same compact footprint as the CMAT, the AEi bestseller.
Wire bonding with intelligent quality control
Another attraction at the ASMPT booth is the Eagle AERO high-end wire bonding solution for super-tight pin densities. With the AEROEye, the AERO devices deliver intelligent monitoring and quality assurance in real time. For typical copper wiring applications, the Eagle AERO churns out up to 30 percent more units per hour and handles faults very effectively with its auto-thread wire function. Another feature that makes the user’s job easier is the Aero BRO software for faster machine setups during product changeovers.
About ASMPT Limited (“ASMPT”)
ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT’s offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition to the various solutions that organize, assemble and package delicate electronic components into a vast range of end-user devices, which include electronics, mobile communications, computing, automotive, industrial and LED (displays). ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality.
ASMPT is listed on the Hong Kong Stock Exchange (HKEX stock code: 0522) and is one of the constituent stocks of the Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes, and the Hang Seng HK 35 Index.
To learn more about ASMPT, visit asmpt.com.
For more information about ASMPT Semiconductor Solutions, visit semi.asmpt.com.