Since the launch of the first-ever touch control thermal profiler, M.O.L.E.™ EV6, ECD’s new tool has enjoyed wide industry uptake and has recently integrated additional features like Bluetooth® wireless connectivity. The company announced today that during productronica 2023 in Hall A4, Booth 246/3, visitors can experience M.O.L.E. EV6 first-hand, see a preview of soon-to-be-launched profilers, demo OvenSENTINEL™ reflow monitoring technology, and learn more about the scalable RIDER soldering equipment verification portfolio.
“Maximum productivity and expansive data are the keys to process efficiency and product quality,” says ECD Electronics Division Manager, Mark Waterman. “ECD’s objective from its founding has been to deliver on these elements through robust measurement, monitoring, and analysis technologies. As the market has evolved and data acquisition and presentation made more seamless, our product line has followed suit. The ability to view and act on information immediately through M.O.L.E. EV6’s touchscreen visibility and OvenSENTINEL’s real-time reflow monitoring are two examples that have demonstrated measurable improvements in yield, quality, and cost-efficiency. For ECD, this is a journey, and we continue to add features to existing technologies and bring new solutions to the industry. We’re excited to showcase many of these at productronica 2023.”
Expanding on M.O.L.E. EV6’s feature set, ECD has integrated Bluetooth wireless technology to enable remote data acquisition of real-time profile conditions through its M.A.P. software. This Bluetooth capability, ECD’s scalable WaveRIDER™, OvenRIDER™, and SelectiveRIDER™ sensor products, and the company’s OvenSENTINEL reflow soldering continuous monitoring software will be demonstrated throughout the four-day productronica event.
With the M.O.L.E. EV platform exceeding expectations, ECD has accelerated its planned rollout of additions to the EV-generation profiler portfolio. Currently in development, new high channel count tools will offer more flexibility for the demanding process needs of each customer and address market-specific requirements. Visitors to ECD’s productronica exhibit can see a preview of the new technologies, which are set to be commercialized in early 2024.
“Particularly for high-value, high-reliability PCBs destined for mission-critical applications like automotive, aerospace, alternative energy, and high-performance computing, expanded thermal profile data points are required to ensure compliant, fail-safe manufacturing,” says Waterman. “Our newest EV-series M.O.L.E.s will offer this capability, and we look forward to sharing them with the market soon!”
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