YINCAE Unveils Advanced Liquid Metal Thermal Interface Material with Superior Printability and Reliability –...

YINCAE, a leader in electronic material solutions, today announced the launch of its next-generation Liquid Metal Thermal Interface Material (TIM), engineered with enhanced viscosity...
STI Honors Mark McMeen for 25 Years of Outstanding Service

STI Honors Mark McMeen for 25 Years of Outstanding Service

STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and contract PCB manufacturing, proudly recognizes Mark McMeen, Vice President...
Nordson Test & Inspection to Unveil Next-Generation Inspection and Metrology Technology at SEMICON Taiwan

Nordson Test & Inspection to Unveil Next-Generation Inspection and Metrology Technology at SEMICON Taiwan

Nordson Test & Inspection today announced plans to unveil advanced technology at SEMICON Taiwan, scheduled to take place at TaiNex in Taipei at booth...
PCB West 2025

Users to Lead Free ‘AI in Electronics’ Panel at PCB West 2025

The Printed Circuit Engineering Association (PCEA) today announced a special free panel session on “What Users Really Think of Today’s AI.” The one-hour session...
KYZEN to Focus on AQUANOX A4618 and Process Control at SMTA Ohio Valley Expo and Tech Forum

KYZEN to Focus on AQUANOX A4618 and Process Control at SMTA Ohio Valley Expo...

KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Ohio Valley Expo & Tech Forum on Thursday, August...
Magnalytix’s Dr. Mike Bixenman to Guide PDC at SMTA High-Reliability Cleaning and Conformal Coating Conference

Magnalytix’s Dr. Mike Bixenman to Guide PDC at SMTA High-Reliability Cleaning and Conformal Coating...

Magnalytix, providing real-time reliability solutions for electronics manufacturing, is excited to announce that Dr. Mike Bixenman will present the professional development course “The Effects...
Federal Electronics Mexico Enhances SMT Line with Installation of Heller Industries Reflow Oven

Federal Electronics Mexico Enhances SMT Line with Installation of Heller Industries Reflow Oven

Federal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its surface mount technology (SMT) operations with the installation of a new...
Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices

Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping...
Federal Electronics Marks 10th Year of ISO 13485 Certification with Successful 2025 Surveillance Audit

Federal Electronics Marks 10th Year of ISO 13485 Certification with Successful 2025 Surveillance Audit

Federal Electronics, a leader in providing advanced electronic manufacturing services, has successfully completed its 2025 ISO 13485:2016 surveillance audit at the company’s Cranston, Rhode...
FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot

FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot

FlashPCB, a leading provider of quick-turn PCB assembly, has expanded its surface mount production capabilities with the installation of a Heller 1809 MKII reflow...