Hirose Launches World’s Smallest Width Multi-RF Board-to-Board Connector

Hirose has released a multi-RF board-to-board connector that provides a size reduction of up to 71% compared to conventional designs. With the industry’s smallest...

Abracon Doubles the Quantity of Inductor Products On Website

Abracon, a leading provider of Frequency Control, Timing, Power, Magnetics, RF and Antenna solutions, has recently expanded its product offering of Inductors to more...

Nano Dimension Announces Sale to the University of Stuttgart Additively Manufactured Electronics (AME) DragonFly®...

Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, announced...

TAGARNO Introduces Glare Removal Feature for Enhanced Microscopy Imaging

TAGARNO, a leading provider of digital microscopes, today announced the launch of its new Glare Removal feature, a groundbreaking advancement that empowers microscope operators...
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North American PCB Industry Sales Up 6.7 Percent in May

IPC announced today the May 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.89. Total North American...
PACE Announces Summer Sale of ADS200® Professional Soldering Stations

PACE Announces Summer Sale of ADS200® Professional Soldering Stations

For a limited time, PACE Worldwide is offering a $100 off list sale price on all of their ADS200 soldering stations. The discount will...
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North American EMS Industry Up 7.1 Percent in May

IPC announced today the May 2023 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.24. Total North American...

YINCAE Launches Snap Cure, Highly filled,100% No-Clean Flux Residue Compatible Underfill: UF 120HA

YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative underfill material is specifically designed...

MacDermid Alpha Electronics Solutions Expands Market Presence in Israel with New Channel Partnership

MacDermid Alpha, a leader in integrated technologies and materials for the electronics industry, is pleased to announce its Channel Partnership Agreement with Amza Ltd....
Indium Corporation to Host Webinar on LED Device Assembly

Indium Corporation to Host Webinar on LED Device Assembly

Indium Corporation’s Evan Griffith, Product Specialist for Semiconductor and Advanced Assembly Materials, will host two webinars about the increasing complexity of LED device assembly...