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Hernon Manufacturing Introduces Tuffbond® 321 for Casting, Potting and Encapsulating Components
Hernon Manufacturing, Inc.®, a leading producer of high-performance adhesives, sealants, UV LED curing lights and precision dispensing systems, is pleased to introduce Tuffbond® 321....
New CO2 snow-jet booths in cleanroom compatible design Effective CO2 snow-jet cleaning process for...
Whether in medical engineering, the semiconductor industry, in laboratory and development environments or in other areas - parts produced in small quantities often have...
AVX Partners with the DRAGON / PENSKE AUTOSPORT Formula E Racing Team for the...
AVX is proud to join Mouser Electronics and TTI, Inc. in a strategic partnership with the newly rebranded DRAGON / PENSKE AUTOSPORT racing team...
Libra Industries Promotes Jim Kircher to CEO with Retirement of Rod Howell
Libra Industries, a privately-held systems integration and electronics manufacturing services (EMS) provider, has named Jim Kircher, President and Chief Executive Officer. Mr. Kircher has...
SECS/GEM Communication Package Announced for MPM Edison Stencil Printer
ITW EAE announces a new SECS/GEM communication package for the MPM® Edison™ Printer. SECS/GEM is a semiconductor market communication standard that provides a common...
World’s First Commercially Available Diamond Filled Underfill: SMT 158D8
YINCAE is excited to announce that we have developed SMT 158D8 a high thermal conductive underfill that is capillary and fast flowing, and an...
Tech Etch Installs Aqua Rose from Austin American Technology
Tech Etch, a leading provider of custom flex and rigid-flex circuits, EMI/RFI shielding solutions, and precision etch & form, today announced the purchase of...
Webinar: Future Electronics and CalcuQuote Address: Development to Deployment: Building an API Connection
In the fourth part of CalcuQuote’s partner webinar series, Kaitlyn Dotson, VP of Operations, is joined by Future Electronics to expand the conversation around...
Electrical Wire Processing Technology Expo (EWPTE) 2021 Postponed to May 10-12, 2022
The 2021 Electrical Wire Processing Expo (EWPTE) originally scheduled at the Wisconsin Center in Milwaukee, Wis. for May 11-13, 2021 has been postponed to...
Versinetic launches Charging Blox to accelerate EV charge point rollout
Flexible hardware and software tools combine to create complete EV charge point solutions, providing a faster route to market for UK and EU smart...
