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Federal Electronics Enhances Cable and Wire Harness Capabilities at Cranston Facility
Federal Electronics, a leader in providing advanced electronic manufacturing services, is proud to announce the expansion of its cable assembly and wire harness capabilities...
TRI wins two CIRCUITS ASSEMBLY New Product Introduction Award
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce that it has received...
SHENMAO PF925 High-Reliability Solder Provides Superior Strength and Hot-Tearing Resistance
SHENMAO America, Inc. continues to advance soldering solutions with its PF925 High-Reliability Solder, designed to improve mechanical strength, thermal stress resistance, and defect prevention...
ITW EAE Electrovert Matrix Manifold Wins New Product Innovation Award
Electrovert is proud to announce that its Matrix Manifold system has won the New Product Innovation Award (NPI). Electrovert’ s Matrix Manifold is the...
Viscom Expands Distribution Network with PBT Rožnov in the Czech Republic
Viscom SE is expanding its distribution network in Central Europe through a new partnership with PBT Rožnov, a leading provider of electronics manufacturing solutions...
Silicon Mountain Implements Cetec ERP to Enhance Manufacturing Efficiency and Customer Experience
Silicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, has implemented Cetec ERP, a state-of-the-art enterprise resource planning system. This investment...
New Stationary Camera for SIPLACE Placement Machines
Market and technology leader ASMPT is offering a new stationary camera available for its placement machines equipped with SIPLACE placement heads CPP and TWIN....
KYZEN Announces the Retirement of Longtime Executive Vice President Tom Forsythe
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announces the retirement of Tom Forsythe, Executive Vice President, effective December 31, 2024, after...
Luminovo Expands into North America with Strategic New Hires
Luminovo, the number one quoting, procurement and collaboration software for the electronics supply chain, is accelerating its U.S. expansion with the addition of three...
YINCAE: UF 158UL Redefines Underfill for Large Chips
YINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed...
