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KIC Celebrates 45 Years as the Pioneer in Thermal Process Monitoring
KIC is well-known as the market and innovation leader in solutions for reflow and wave soldering process management. Going into its 45th year as...
Hentec Industries/RPS Automation Anticipates a Strong Sales Year in 2022
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that due to pent-up demand throughout this past...
CSR / CSRN Thick Film Current Sense Resistors Ideal For a Broad Range Of...
Modern electronics systems are currently running at the highest efficiency levels in history. This in large part is due to lower operating voltages and currents,...
Fully Flux Residue Compatible, Room Temperature Fast Flow, Reworkable Underfill SMT 88UL2
YINCAE is excited to announce that we have developed and upgraded SMT 88UL to SMT 88UL2, a fully flux residue compatible, room temperature fast...
MacDermid Alpha’s Kester Brand Announces Partnership with Proactive Process Solutions Group, LLC
The Kester brand of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched...
Breakthrough PulseForge® Soldering Tools to be Featured at APEX
PulseForge Corp, a new spinoff of NovaCentrix, today announced plans to demonstrate their breakthrough soldering tools during the 2022 IPC APEX EXPO, scheduled to...
Indium Corporation’s Brian O’Leary Accepts ‘Global Head of e-Mobility & Infrastructure’ Role
Indium Corporation is pleased to announce that Brian O’Leary has accepted a new role as Global Head of e-Mobility & Infrastructure in addition to...
Insituware to Demo Vision MARK-1 Device for Conformal Coating and Solder Paste Fitness for...
Insituware LLC, the developer of the first smart measurement solution for quality control of materials, is pleased to announce plans to exhibit at the...
Jade Micron Pte Ltd Orders Second Hentec/RPS Pulsar Solderability Test System
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Jade Micron Pte Ltd....
Wafer-Level Packaging Symposium (WLPS) Program Announced and Registration Now Open
The SMTA is pleased to announce the technical program for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 15-17, 2022 at...
