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Sharp Decline in European Electronics Manufacturing Jeopardizes Strategic EU Priorities
A new report by IPC, reveals Europe’s growing dependency on other regions for electronics manufacturing in critical and strategic sectors including aerospace and defence....
Cleaning and Activating Surfaces with Openair-Plasma for High-performance Electronic Products
Safe and effective cleaning of components and reduction of oxide layers, e.g. in semiconductor production or IGBT power modules, is essential for the electronics...
Tresky Allows Dispensing of Over 100 mm² for Large Area Sintering Applications
The integration of large-area power modules with an area of over 100 mm² is highly relevant. These modules are of great importance for various...
ASMPT Combines High-speed Chip Assembly Directly From the Wafer with SMT Placement in a...
As automotive applications, 5G and 6G, smart devices and many others require ever more compact and powerful components, advanced packaging becomes one of the...
The New Piezo Dispensing System MDS 3581 Offers High Application Stability Even Under Extreme...
The new MDS 3581 micro dispensing system from VERMES Microdispensing is equipped with the patented Piezo Xtreme 2 actuator, which ensures maximum stroke and...
Experiencing Cutting-Edge Inspection Solutions at PCIM Europe 2024 with Viscom
Viscom AG is excited to announce its participation in PCIM Europe 2024, the leading international exhibition and conference for power electronics, intelligent motion, renewable...
New Soldering and Tinning Pastes for Soft Soldering From Emil Otto
Emil Otto GmbH is further expanding its metal chemistry product portfolio for soft soldering with the new ZINNIN Green soldering and tinning pastes. The...
Essemtec is Exhibiting at SMTconnect Booth 4.209
We invite you to SMTconnect, Booth 4.209, from June 11 - 13 in Nuremberg, Germany. Discover Essemtec's solutions with all-in-one combined dispensing & pick-and-place...
Partner stand of the International Semiconductor Alliance at PCIM Europe 2024
The International Semiconductor Alliance (ISA) will be presenting state-of-the-art solutions for manufacturing and process optimization in the semiconductor industry at this year's PCIM 2024...
Manual Mode for Maximum Control and Flexibility with DIE Bonders
The DIE bonders from German specialist Tresky are equipped with a flexible, manual mode. This reduces the entry barrier for new users and makes...
