IPC presented its highest corporate honors to two IPC member companies, Summit Interconnect and Robert Bosch GmbH during the IPC Annual Meeting/Awards Ceremony at...
IPC announced today the February 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.07.
Total North...
IPC announced today the February 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.22.
Total North American...
The SMTA announces three conferences taking place in Europe this spring.
The Advanced Electronics Assembly Conference (AEAC) will co-locate with InnoElectro, 24 April 2024 in...
Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly...
IPC has announced the expansion of its complimentary training offerings for IPC members with the introduction of a “Foreign Object Debris (FOD) for Electronics...
Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, to announce its participation in the 2024 IPC APEX EXPO, scheduled...
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its receipt of recognition for 25...
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Dallas Expo and Tech Forum, scheduled to take place...