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Koh Young America is Proudly Sponsoring the Mid-Atlantic SMTA Virtual Learning Event on Failure...
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is excited to be a corporate sponsor at the upcoming four-day virtual SMTA chapter...
Transition Automation to Exhibit at SMTA Ohio Valley Expo & Tech Forum
Transition Automation, Inc. announces that it will exhibit a complete display of Permalex Long Life Metal Squeegees and Advanced Holder Systems in Booth #12...
Saki’s 3Si SPI and 3Di AOI Series Awarded IPC-CFX Certification
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces that the 3Si Solder Paste Inspection (SPI) and 3Di...
Hentec/RPS to Exhibit at SMTA Ohio Valley Expo & Tech Forum on August 25th
Hentec Industries/RPS Automation announces that it will exhibit its full line of selective soldering, component lead tinning and solderability test equipment at the upcoming...
IPC Commends U.S. Senate on Passage of Bipartisan Infrastructure Bill
“Electronics manufacturers welcome the prospect of historic infrastructure investments in America’s roads, ports, electric grids, and digital networks. Our members’ supply chains depend on...
Koh Young America Participating at the SMTA Ohio Valley Expo & Tech Forum on...
In support of the SMTA and its local chapters, Koh Young America will be supporting the Ohio Valley Expo & Tech Forum Wednesday, August...
Scienscope to Introduce New Smart Storage Rack at SMTAI
Scienscope International, a leading American supplier of cabinet-style micro-focus X-ray systems, will exhibit at the SMTA International Exposition, scheduled to take place Nov. 3-4,...
IPC Welcomes U.S. Senate Vote on Infrastructure Bill but Questions Superfund Tax
“Electronics manufacturers welcome the prospect of historic infrastructure investments in America’s roads, ports, electric grids, and digital networks. Our members’ supply chains depend on...
IPC Launches Electronics Assembly for Engineers Course
Electronics manufacturing is growing at record levels across the globe. Many companies are hiring new engineers and technical staff into DFM, Product, Manufacturing, Process,...
Wafer-Level Packaging Symposium Announced
The Wafer-Level Packaging Symposium is scheduled for February 15-17, 2022 in San Jose, CA, USA. The theme of the event is “Advanced Packaging: The...
