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Koh Young Honored with Multiple Product Awards at IPC APEX EXPO
Koh Young Technology, the industry-leader in True 3D measurement-based inspection solutions, is proud to announce the industry recognized two of its new electronics inspection...
Automating Wedge Bonding for Complex Wire Components
RF and mmWave specialist, Filtronic has further enhanced its hybrid and semiconductor packaging capabilities by investing in a fully automated wedge bonder suitable for...
In-line Ultrasonics Monitoring with Innovative APM Solution from Ecoclean
In high-purity industries, companies are increasingly faced with the challenge of recording and documenting all cleaning process parameters for each batch of parts. Until...
SMT Tooling to Demo Matrix Tooling on a Hanwha / ESE Screen Printer at...
SMT Tooling, a division of PSA Systems, today announced that it will showcase its Matrix™ Automatic SMT Support Tooling system on a Hanwha/ESE printer...
Heraeus Electronics Provides Latest Materials Portfolio for Next-generation Power Electronics and Semiconductor Advanced Packaging...
Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place January 25-27, 2023,...
Viscom Inc. Appoints Juan C. Briceño as Vice President of Sales – Americas
Viscom Inc., the U.S. subsidiary of Viscom AG, Germany, has announced the appointment of Juan C. Briceño as Vice President of Sales – Americas....
Halo Microelectronics Agrees to Sell Its AC-DC Silicon Controller IC Venture
Halo Microelectronics, a maker of analog and power management integrated circuits enabling energy-efficient smart systems, announced an agreement to sell the remaining interest in...
StenTech Opens New Facility in Philadelphia
StenTech® Inc., the leading multinational SMT Printing Solutions company, is pleased to announce the opening of its newest facility in Huntingdon Valley, Philadelphia. The...
DuPont To Showcase Innovative Material Solutions for Next-Level PCB Designs at IPC/APEX Exhibit
DuPont Interconnect Solutions (ICS), a business within the Electronics & Industrial segment, will exhibit (Booth #341) at the 2023 edition of the Institute for...
Retronix Turns to Gen3 Again for High Quality PCB Cleaning Requirements
Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, is pleased to announce that they were once again selected by...
