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IPC Launches Electronics Assembly for Engineers Course
Electronics manufacturing is growing at record levels across the globe. Many companies are hiring new engineers and technical staff into DFM, Product, Manufacturing, Process,...
Wafer-Level Packaging Symposium Announced
The Wafer-Level Packaging Symposium is scheduled for February 15-17, 2022 in San Jose, CA, USA. The theme of the event is “Advanced Packaging: The...
Kurtz Ersa establishes 100% subsidiary in India
With “Kurtz Ersa India – Smart Production Technologies Private Limited”, the tenth international subsidiary of the machine manufacturer Kurtz Ersa is launched. Headquarters of...
CyberOptics to Showcase High-Precision Inspection and Metrology Solutions at the SEMI Connecting Heterogeneous Systems...
CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will feature the WX3000™ metrology and inspection system...
Austin American Technology to Attend SMTA Ohio
Austin American Technology (AAT) today announced that it will attend the upcoming SMTA Ohio exhibition, scheduled to take place Wednesday, August 25, 2021 at...
Cogiscan Appoints Michael Ho, Director – Business Development, to Expand Factory Digitalization
Cogiscan, the leading connectivity and TTC solutions provider for the electronics manufacturing industry, is proud to announce the appointment of Michael Ho as Director...
Hentec/RPS Expands Assembly Capacity to Accommodate Increase in Sales
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has added assembly and production staff...
New Standard Cell Concept for Special Soldering Automation
In order to be able to offer even higher precision and modularity, Eutect GmbH has developed a scalable standard cell with the automation specialist...
Precisely controlled cooling process and individual adjustment of the cooling gradient
With the VisionXP+ convection soldering system from Rehm Thermal Systems, the soldering process does not end with the melting of the solder. For an...
Indium Corporation Expert to Host SiP Printing Webinar
Indium Corporation’s Evan Griffith, product specialist for Semiconductor and Advanced Assembly Materials, will host two webinar sessions about the fundamentals of System-in-Package (SiP) printing...
