Chipmind Launches from Stealth with $2.5m for its AI Agents to Speed Chip Making

Chipmind Launches from Stealth with $2.5m for its AI Agents to Speed Chip Making

Today Chipmind, the first European startup building AI agents to accelerate the development of microchips, launches Chipmind Agents, optimized to empower engineering teams in...
Indium Corporation Introduces 2026 DIY Internship Program to Empower the Next Generation of Industry Leaders

Indium Corporation Introduces 2026 DIY Internship Program to Empower the Next Generation of Industry...

Indium Corporation is proud to announce its 2026 Internship Program, introducing a do-it-yourself (DIY) format that allows students to shape a personalized professional experience...
Fuji America Promotes Chris Dayney to Technical Marketing Manager, Expanding Focus on Premium Technical Content

Fuji America Promotes Chris Dayney to Technical Marketing Manager, Expanding Focus on Premium Technical...

Fuji America Corporation is proud to announce the promotion of Chris Dayney to Technical Marketing Manager. Based in Crossville, Tennessee, Dayney has more than...
DELO and DATRON Drive Industrialization of Fuel Cell Sealing Applications with Joint System Solution

DELO and DATRON Drive Industrialization of Fuel Cell Sealing Applications with Joint System Solution

DELO and DATRON have developed a system solution that enables the sealing of fuel cells to be carried out with a high degree of...

BTU International Announces Strategic Manufacturing Expansion in Singapore to Strengthen Global Supply Chain

BTU International, a leading global supplier of advanced thermal processing equipment for electronics assembly, today announced plans to expand its manufacturing operations into Singapore....
StenTech Strengthens Precision Parts Platform with AME Acquisition

StenTech Strengthens Precision Parts Platform with AME Acquisition

StenTech, North America’s leading provider of SMT printing solutions and precision manufacturing, has announced the acquisition of Advanced Metal Etching, Inc. (AME), a recognized...

YINCAE Launches UF 66L Optical Clear Underfill for High-Reliability Silicon Photonics and Optoelectronic Packaging

YINCAE is proud to announce the release of UF 66L, a next-generation Optical Clear Underfill (OCU) engineered for silicon photonics, optoelectronic packaging, image sensors,...
SolderKing Earns Bronze EcoVadis Medal for Second Consecutive Year

SolderKing Earns Bronze EcoVadis Medal for Second Consecutive Year

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, has announced the launch of its new Nippon Nozzle division, dedicated...
SolderKing Earns Bronze EcoVadis Medal for Second Consecutive Year

SolderKing Earns Bronze EcoVadis Medal for Second Consecutive Year

SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, has been awarded a Bronze Medal by EcoVadis for the second...
Kurtz Ersa Discusses Smart Soldering Technology for Cutting-Edge Process Control and Efficiency at SMTA Tijuana Expo

Kurtz Ersa Discusses Smart Soldering Technology for Cutting-Edge Process Control and Efficiency at SMTA...

Kurtz Ersa Inc., a leading supplier of electronics production equipment, will exhibit at the SMTA Tijuana Expo on Thursday, November 13, 2025, at the...