Inovaxe Welcomes Jim Dickerson as New Western Regional Sales Manager

Inovaxe Welcomes Jim Dickerson as New Western Regional Sales Manager

Inovaxe, a world leader and provider of innovative material handling and inventory control systems, is pleased to announce the addition of Jim Dickerson as...
KYZEN Wins 17th CIRCUITS ASSEMBLY Service Excellence Award for Outstanding Customer Service

KYZEN Wins 17th CIRCUITS ASSEMBLY Service Excellence Award for Outstanding Customer Service

KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is proud to announce that it has been honored with its 17th Service Excellence...
Koh Young Earns Industry’s Highest Customer Service Award Again

Koh Young Earns Industry’s Highest Customer Service Award Again

Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, has been honored with the 2024 Service Excellence Award from Circuits Assembly—marking...

North American PCB Industry Shipments Down 24.1 Percent in September

IPC announced today the September 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.08. Total North...
Overcome Pre-Production Challenges In Electronics Manufacturing

Discover How Microboard Improved it’s CCA Pre-Production Process with ScanCAD

Facing inefficiencies and quality control challenges during pre-production, Microboard turned to ScanCAD to improve circuit card assembly inspections. Traditional reliance on Gerber data from...

Emil Otto Launches New Stencil Cleaner

The German specialist for fluxes and cleaning agents for electronics production presents the new Etimol SW 22 CN stencil cleaner for the automated cleaning...
ITW EAE

ITW EAE Wins Global Technology Award for MPM® Edison II ACT (Automatic Changeover Technology)

ITW EAE is proud to announce that it has earned a 2024 Global Technology Award for MPM’s Edison II ACT. The MPM® Edison™ II...

Test and Inspection at SMTA Space Coast Expo & Tech Forum 2024

Test Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, will participate in the SMTA Space Coast...

DELO Introduces UV-approach for Fan-out Wafer-level Packaging

DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of...

2024 IPC CEMAC China Electronics Manufacturing Annual Conference Focuses on the Electronics Industry’s Future

The 2024 IPC CEMAC China Electronics Manufacturing Annual Conference, co-organized by IPC and the Shanghai Pudong New Area Quality Technology Association, kicked off today...