KIC, experts in electronics assembly thermal process temperature profiling and monitoring, is proud to announce that its SPS and X5 Profilers featuring Fan Speed Prediction in Thermal Analysis System (TAS) software received a 2026 Global Technology Award in the Thermal Profilers category. The award was presented during the Global Technology Awards ceremony on Tuesday, October 27, 2026, at SMTA International in Rosemont, Illinois.

Fan Speed Prediction is the industry’s first profiler-based solution to incorporate fan speed behavior directly into the recipe prediction engine alongside temperature and conveyor speed, creating a three-variable approach to reflow recipe optimization.

Historically, thermal recipe optimization has focused primarily on conveyor speed and oven zone temperature setpoints. Fan Speed Prediction allows engineers to model how airflow changes affect board heating, reflow characteristics, and cooling performance before running production, reducing trial-and-error during process development.

The technology also enables rapid product changeovers by optimizing recipes using fan speed and conveyor speed adjustments without requiring changes to oven temperature setpoints. This reduces thermal stabilization wait time and provides greater manufacturing flexibility, particularly in high-mix production environments.

Fan Speed Prediction can also create opportunities for energy savings and reduced equipment stress. In one validation study, TAS identified optimized recipes that reduced fan speeds from 100% to 70% while maintaining an acceptable Process Window Index (PWI).

KIC Fan Speed image (002) copy
KIC Fan Speed image (002) copy

“We are honored that the SPS and X5 Profilers with Fan Speed Prediction have been recognized with a Global Technology Award,” said Miles Moreau, General Manager of KIC. “By adding fan speed to the prediction process, we’re giving manufacturers greater flexibility to develop efficient, repeatable recipes while reducing setup time and trial-and-error. It’s another step forward in making thermal process optimization more intelligent and data-driven.”

Since 2005, the Global Technology Awards have recognized outstanding innovations in the printed circuit assembly and packaging industries, celebrating the companies and technologies advancing the global SMT and advanced packaging industry.

To learn more about KIC’s SPS and X5 Profilers and Fan Speed Prediction in Thermal Analysis System (TAS) software, visit www.kicthermal.com.