MIRTEC, the ‘Global Leader in Inspection Technology’, announced its participation in the SEMICON West 2026. The premier event will be held from October 13rd ~ 15th, 2026, at the San Francisco Moscone Center. Visitors can find MIRTEC at Booth #6162, where MIRTEC will showcase its advanced semiconductor inspection system MV-9SIP.
Key Inspection Systems on Display:
MV-9SIP
The MV-9SiP Hybrid 3D Inspection System combines 2D vision, 12-projection Digital Blue Light Moiré, and Blue Laser Scanning in a single semiconductor inspection platform. Its proprietary 25MP CoaXPress vision system with 7.7µm resolution precisely inspects 01005 chip arrays, solder balls, bumps, and densely packed packages. The 8-phase coaxial color lighting enhances crack and surface-defect visibility on reflective CSP components, while the blue laser scanner reliably measures highly reflective and low-reflective surfaces.
MS-15 Bump
The MS-15 Bump is a premium 3D SPI solution engineered for ultra-precision inspection of semiconductor and high-density SMT applications. Equipped with a 25MP high-resolution camera and selectable 4µm/6µm telecentric lenses, it delivers stable, distortion-free measurement of ultra-fine pads as small as 60µm × 60µm and precise height inspection down to 20µm. The Dual Projection Probe minimizes shadow and reflection effects to ensure reliable 3D volume measurement even around high-profile components. Combined with a closed-loop system that provides real-time feedback and feed-forward communication with screen printers and placement equipment. The MS-15 Bump delivers exceptional measurement accuracy, process stability, and productivity for advanced semiconductor and fine-pitch manufacturing environments.
Commitment to Smart Manufacturing
“MIRTEC remains committed to advancing inspection technology and delivering reliable solutions for the evolving needs of electronics manufacturers,” said Roony Kim. “By combining high-precision inspection, AI-driven innovation, and extensive industry expertise, we continue to support demanding applications across the automotive, aerospace, and defense sectors while helping manufacturers achieve greater quality, productivity, and process reliability.”
