Over the past decade, the challenges facing the electronics sector have intensified: technological innovation, supply chain management, industrial competitiveness, sovereignty and sustainability requirements.
This context requires all stakeholders — designers, engineering firms, substrate manufacturers, OEMs and assemblers — to anticipate, understand and continuously integrate these new constraints, whether they relate to technological advances, innovation or environmental challenges.
Having this in mind, Inventec Performance Chemicals, IFTEC and We Network have decided to bring together the printed circuit board sector for a new technical event dedicated to design, PCBs and electronic assembly: SLAM Conference.
Organised with the support of the French Electronics Federation, the SLAM Conference aims to become a leading unifying event in France. The event seeks to promote knowledge sharing, the dissemination of state-of-the-art developments, exchanges between experts and the emergence of new synergies across the entire French and European value chain.
The SLAM Conference will be held every two years, with the first edition taking place from 25 to 27 November in Angers, one of France’s leading regions for electronics, where the sector is firmly established.
Today, SLAM Conference is launching its call for papers with a view to bringing together the best technical, industrial and academic expertise, and thus putting together a state of-the-art programme.
OPENING OF THE CALL FOR PAPERS
Six key themes have been identified to structure the programme for SLAM Conference 2026, reflecting the main technological and industrial challenges currently facing the printed circuit board ecosystem:
- Design / DfX (Design for X)
- PCBs & Substrates
- Assembly processes
- Testing, Inspection & Smart Factory
- Reliability & Quality of Assemblies
- Sustainability & Circularity
Contributions must fall within one of these six themes and will be assessed by a technical committee comprising 16 recognised experts. The committee will collectively select the contributions that will form the technical programme of the SLAM Conference 2026.
SLAM Conference will prioritise content highlighting technological advances, feedback from experience and real-world examples in order to provide practical and expert information.
CALENDAR AND PRACTICAL INFORMATION
Proposals to contribute to the programme should be submitted via the official SLAM Conference website, under the ‘Call for Papers’ section: www.slam-conferenceelectronique.fr
The schedule:
- Opening of the call for papers: June 1st 2026
- Deadline for submitting proposals: July 10th 2026
- Early September 2026: finalisation of the selection of proposals by the technical
committee, approval of the programme and opening of registrations.
SLAM CONFERENCE, AN EVENT SUPPORTED BY THE FRENCH ELECTRONICS
FEDERATION
“Supporting SLAM Conference 2026 is fully in line with our mission: to support the development, competitiveness and autonomy of the French electronics sector. By bringing together manufacturers, experts and academics to discuss strategic technological themes, this event helps to advance the entire ecosystem, foster synergies and sustainably strengthen collective momentum.” Laurence Dassas, Executive Director, French Electronics Federation
