KOKI Company Ltd., a global leader in advanced soldering materials, is expanding their Low-Ag solder portfolio. As silver prices continue to fluctuate, electronics manufacturers across Europe are reassessing material strategies to balance cost control with consistent process performance and long-term reliability.
KOKI Company Ltd. addresses this challenge with an expanded portfolio of low-silver (Low-Ag) solder pastes and wire solutions, designed to reduce material costs while maintaining the process stability required in modern SMT and assembly environments.
Traditional SAC305 alloys (~3.0% Ag) remain widely used but expose manufacturers to ongoing cost variability. KOKI’s Low-Ag approach focuses on optimizing silver content through advanced alloy design and micro-alloying, enabling stable wetting behavior and controlled intermetallic formation while reducing reliance on high silver content.
BIG Series Low-Ag Solder Paste: A Practical Alternative
KOKI’s BIG Low-Ag Alloy Series, including S1XBIG58-HF1200B and S01XBIG58-HF1200B, offers a cost-conscious alternative to SAC305:
- ~0.1–1.1% Ag content (vs. ~3.0% in SAC305)
- Up to 40–60% potential material cost reduction (depending on silver market conditions)
- Compatibility with standard SAC305 reflow profiles, minimizing process requalification
- Stable wetting performance with controlled voiding behavior
- Validated reliability through thermal cycling and mechanical testing
The BIG series enables manufacturers to reduce material costs without introducing significant process disruption.
72M Series Low-Ag Wire Solder: Supporting Process Efficiency
Complementing the paste portfolio, KOKI’s 72M series wire solders, including S03X7Ca-72M (0.3% Ag) and S01X7Ca-72M (0.1% Ag), are designed for both manual and automated soldering applications.
Key characteristics include:
Cost & Durability
- Reduced silver content (0.1–0.3% Ag)
- Anti-iron tip erosion properties, supporting extended tip life
Process Performance
- Improved wettability and solder flow
- Reduced bridging under challenging process conditions
- Consistent flux behavior and coverage
Automation Compatibility
- Suitable for robotic soldering applications
- Residues designed for simplified cleaning processes
“Manufacturers should not have to choose between cost control and long-term reliability,” said Johan Wallentin. “Our Low-Ag strategy focuses on optimizing alloy design to deliver both, while maintaining compatibility with established assembly processes.”
With Low-Ag solutions available across both solder paste and wire formats, KOKI provides a comprehensive approach to reducing silver dependency across SMT reflow, manual soldering, and automated assembly processes. This allows manufacturers to align material selection with application requirements while managing cost exposure more effectively.
Learn More:
BIG Series Low-Ag Solder Paste: www.koki-global.com/product/s01xbig58-hf1200b
72M Series Low-Ag Wire Solder: www.koki-global.com/product/s01x7ca-72m
About KOKI
Founded in 1964, KOKI is a global leader in advanced soldering materials, focused on innovation, sustainability, and regulatory compliance. In addition to its materials portfolio, KOKI offers in-depth technical services and analytical support to help customers optimize soldering performance across a wide range of applications worldwide.
