KONIG, a leading specialist in electronic packaging protection, is proud to announce its selection as a BrandNEW Most Popular New Product Enterprise at this year’s productronica China.
The award honors KONIG’s groundbreaking KP400 3D Digital Packaging System—an innovative 3D printing-based solution that redefines PCBA, FPC, and Mini-LED protection. By replacing traditional coating, dispensing, and potting processes with a single, digital workflow, KP400 addresses critical industry pain points around efficiency, precision, and cost.
Why KP400 Stood Out:
Pixel-Perfect Precision: 400dpi jetting delivers printing-like accuracy for dense, high-component layouts.
Mask-free Efficiency: Eliminates tape, jigs, and manual labor. Thin-layer coating completes in just 2 seconds per board, boosting UPH and yields.
All-in-One Versatility: Integrates dispensing, coating, and potting into one machine with flexible protection modes.
Proven Reliability: 1,000+ array nozzles at 20kHz ensure consistent, high-speed production. 3D stacking forms durable, stress-resistant barriers.
Greener Manufacturing: Selective material deposition reduces waste; solvent-free UV LED curing supports sustainable goals.
About KONIG
A national-level Specialized, Refined, Unique, and Innovative “Little Giant” since 2010, KONIG combines deep expertise in Low Pressure Injection Molding and 3D Digital Packaging. Serving SMT, semiconductor, automotive, and medical electronics, KONIG helps manufacturers cut costs, improve quality, and accelerate innovation.
With this award, KONIG reaffirms its commitment to practical, impact-driven technology. The company will continue advancing its solutions to meet the demands of smarter, more connected manufacturing.
