E-tronix, a leading manufacturer’s representative serving the electronics manufacturing, wire and cable, and medical device industries, is pleased to announce an upcoming technical webinar in collaboration with LPMS USA focused on the growing role of low pressure molding (LPM) in protecting electronic assemblies operating in harsh environments.
As electronic systems continue to expand into demanding applications, including EV systems, medical devices, outdoor sensors, and industrial controls, traditional protection methods such as conformal coating and potting are showing their limitations. This webinar will explore how LPM provides a controlled, single-step encapsulation process that eliminates masking, reduces cycle time, and minimizes material usage through precision mold design.
During the session, attendees will gain a deeper understanding of:
- The low pressure molding process and available equipment platforms
- Material behavior, adhesion characteristics, and environmental performance
- How LPM protects sensitive circuitry without introducing mechanical stress
- Strategies to improve manufacturing efficiency by eliminating curing cycles and reducing energy consumption
“Manufacturers are under increasing pressure to improve reliability while reducing cost and process complexity,” said Erik Stromberg of E-tronix. “This webinar is designed to provide a practical, technical look at how low pressure molding addresses those challenges head-on.”
Event Details:
Date: Thursday, April 16th
Time: 10:00 PT | 12:00 CT | 1:00 ET
Register Here: https://meet.zoho.com/cerg-myi-ubv
About E-tronix
E-tronix is a manufacturers’ representative firm serving the electronics manufacturing, wire and cable, and medical device industries. The company is dedicated to delivering best-in-class materials and equipment that empower customers to optimize performance and achieve lasting success. With a commitment to innovation, quality, and partnership, E-tronix stands as a trusted ally for sustainable growth.
