Martin Hart, President of TopLine Corporation and holder of multiple patents in the field of electronic components, will present “Reliability of Cu-Wrap and Braided CGAs for Extreme Cold Applications,” co-authored with Dr. Reza Ghaffarian of JPL, at the 29th Annual Components for Military & Space Electronics Conference & Exhibition. The conference is being held April 28 – April 30, 2026, at the Renaissance Los Angeles Airport Hotel. Marty will be giving his talk after lunch on Apr 29.
“Braided Solder Columns are non-collapsible, robust and compliant structures used for reducing stress caused by CTE mismatch,” Hart says. “Columns are more reliable than solder balls, especially when connecting large-size chip packages to PC Boards operating in cryogenic environments. Additionally, they are available with lead for Aerospace & Defense applications, but also available in lead-free designs for RoHS AI Datacenters, for example.”
CMSE 2026 is the premier event focused on the design, reliability, and application of electronic components for use in both terrestrial applications for avionics, aerospace, and military, as well as commercial, civilian, and military space systems.
For more information, contact TopLine Corporation at 95 HWY. 22 W., Milledgeville, GA 31061 USA Telephone: 800-776-9888, Email: info@topline.tv.
About TopLine
TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling and practice. TopLine products provide hands-on learning for engineers. TopLine is a pioneer in CGA solder columns technology and low temperature cryogenic package-to-board interconnects. To learn more, visit www.TopLine.tv or call (1+) 800 – 776-9888.
