The CMOS image sensor (CIS) industry is experiencing a period of rapid technological advancement, driven by innovations in semiconductor manufacturing processes. Techniques such as backside illumination (BSI), stacked chip design are enabling the development of smaller, more efficient sensors with enhanced performance.
Florian Domengie, Principal Analyst, Imaging at Yole Group explains: “These processes improve signal-to-noise ratios, optimize performance in low-light conditions, and enable better data management while reducing power consumption. Compactness and integrability are further enhanced through wafer-level packaging and 3D integration, which are critical for meeting the demands of emerging Specialty Technology applications.”
Additionally, next-generation technologies like neuromorphic image sensors and metasurface products promise to revolutionize sensing capabilities by leveraging innovative materials science and design methodologies. These advancements highlight the crucial role of semiconductor manufacturing in shaping the future of CIS technologies.
Join us for this in-depth online event titled, “Shining a light on the next generation of CMOS image sensors manufacturing.”
On May 27, 2025, at 6:00 PM CEST / 9:00 AM PDT, Industry experts from Lam Research and Yole Group will delve into the key industry trends and drivers and present solutions for high-volume manufacturing that are propelling CIS technologies to new heights. REGISTER TODAY!
This webinar, featuring experts from Lam Research and the Yole Group, is a must-attend for semiconductor professionals seeking to understand the future of CIS devices, key technology drivers, and industry-proven solutions for high-volume manufacturing.
Dr. David Haynes, vice president, Specialty Technologies, Lam Research says: “As an industry leader in Specialty Technologies, we are pleased to join forces with the Yole Group to explore the key technology innovations and trends in CIS device manufacturing. We look forward to showcasing Lam’s industry-leading process capabilities that are enabling ever-higher resolutions and improvements in image quality.“
The CIS industry continues its transition…
According to Yole Group’s annual analysis, Status of the CMOS Image Sensor Industry, The CIS market is projected to reach over $28 billion by 2029, growing at 4.7% CAGR of 4.7% from 2023 to 2029. In 2023, the market maintained stable shipment volumes compared to 2022, with a modest revenue increase, reflecting a shift in focus toward higher-value applications, particularly in the automotive sector, driven by rising camera adoption per vehicle and the demand for high-resolution sensors. However, a significant rebound occurred in 2024, with global CIS revenues growing more than 7% on year-over-year basis, boosted by smartphone market positive dynamics.
Shining a light on the next generation of CIS manufacturing – Webcast program
Presented by Lam Research, a leading global supplier of innovative wafer fabrication equipment and services to the semiconductor industry, this program will unveil leading-edge insights, highlight emerging trends, and demonstrate high-volume manufacturing solutions driving CIS growth. This online event will be moderated by Jérôme Mouly, Sensing, Imaging & Display Director at Yole Group.
- From imaging to sensing, semiconductor technologies are enhancing vision applications – Florian Domengie, Principal Analyst, Imaging at Yole Group
- Enabling fabrication solutions to drive performance of next generation CIS devices – Michelle Bourke, Managing Director, CSBG Strategic Marketing and Specialty Technologies, Lam Research Corp. – Dr David Haynes, Vice President, Specialty Technologies, Lam Research Corp.
- Q&A session
Do not miss the opportunity to learn from leading experts about semiconductor manufacturing technologies. Mark your calendar today for the May 27th online event that’s sure to expand your knowledge and help develop your business. Stay tuned on yolegroup.com!
Acronyms
CIS: CMOS Image Sensor
BSI: Back-Side Illumination
CAGR: Compound Annual Growth Rate
