SHENMAO America, Inc. is proud to announce the availability of its lead-free solder paste PF606-P for use in the cutting-edge “Reverse Hybrid” board assembly process. This advanced technique is gaining attention across the electronics industry for its ability to deliver superior reliability and higher yield rates in modern device manufacturing.
The “Reverse Hybrid” assembly process involves using SAC (Sn-Ag-Cu) solder paste in conjunction with BGA components that feature low-temperature solder (LTS) balls. The soldering is performed using a traditional SAC reflow profile, resulting in the formation of a homogeneous SAC-LTS solder joint. This contrasts with the conventional “LTS Hybrid” approach, which utilizes LTS paste with SAC balls and often produces hybrid joints with lower thermal reliability.
By leveraging the Reverse Hybrid process, manufacturers can take advantage of:
- Higher yield rates and improved long-term reliability
- Good compatibility with existing SAC SMT materials and reflow processes
- Enhanced thermal cycling (TC) and drop test reliability
- Superior solder joint homogeneity and mechanical performance
The Reverse Hybrid method is especially beneficial for mainstream advanced packages such as next-generation CPUs, where LTS solder balls are adopted to reduce the ball-attach process temperature. Despite using LTS components, this process enables manufacturers to retain standard SAC reflow conditions, simplifying integration and lowering overall process complexity.
SHENMAO’s PF606-P solder paste has proven to be an ideal material for this application. With excellent printability, solderability, and voiding performance, PF606-P enhances joint quality while minimizing common soldering defects. Its specially formulated flux ensures tight void control and reduces the risk of short defects caused by ball expansion from void formation.
The PF606-P paste is already being successfully adopted by leading manufacturers exploring Reverse Hybrid solutions to meet the demands of today’s high-performance electronics.
For more technical insights on the Reverse Hybrid process, refer to SHENMAO’s presentation at the 2025 SMTA Forum.
For more information on SHENMAO’s PF925 solutions, visit www.SHENMAO.com.
