MacDermid Alpha Electronics Solutions will present its latest materials technologies at NEPCON Thailand 2026, held June 17 to 20 at the Bangkok International Trade & Exhibition Centre (BITEC), Thailand. Recognized as a premier gathering for technology leaders and manufacturers, the event supports one of the world’s most dynamic electronics manufacturing regions.
With electronic designs advancing toward finer geometries, greater functionality, and increasing thermal demands in automotive, high-performance computing, and consumer electronics applications, materials play an increasingly important role in enabling scalable production, consistent assembly outcomes, and long-term reliability.
Featured Technologies at NEPCON Thailand 2026
Reliable Ultra Fine-Feature Printing with ALPHA® OM-377
Miniaturized electronics designs continue to increase demands on print precision and process control in high-density Surface Mount Technology (SMT) assembly applications. ALPHA OM-377 solder paste combines advanced print and reflow performance with ultra-fine powder technology to support complex miniaturized assemblies at production scale. Reliable printing for components down to 008004 helps reduce assembly defects and supports consistent solder-joint performance in fine-feature applications.
Silver-Free Assembly Performance with ALPHA® OM-100 SNCX® 07
Balancing manufacturing efficiency with long-term reliability remains a growing priority in high-volume electronics production. Combining SAC-comparable reliability with up to 50% greater mechanical strain resistance, ALPHA OM-100 SNCX 07 solder paste is designed to support stable processing, improved mechanical performance, and consistent assembly outcomes while maximizing manufacturing value.
Process Consistency for Through-Hole Assembly with ALPHA® EF-6038HF
Through-hole soldering performance remains critical for process consistency and reliability in wave and selective soldering operations. ALPHA EF-6038HF combines broad process capability with enhanced thermal stability and reliable hole-filling performance to support consistent production outcomes and high pin-testing yields in high-volume assembly environments, enabled by a low-residue, no-clean chemistry.
Superior Thermomechanical Reliability with ALPHA Innolot® MXE
Advanced electronics assemblies require materials capable of maintaining long-term reliability under sustained thermal cycling and mechanical stress. ALPHA Innolot MXE solder paste delivers proven thermal cycling performance from -40°C to 150°C, along with enhanced vibration and drop shock reliability for high-reliability electronics applications.
“Thermal management, miniaturization, and increasing performance expectations continue to create new manufacturing challenges as package geometries shrink and assembly processes become more complex,” said Robbie Fu, Director, SMT Product Management. “MacDermid Alpha is focused on advancing material solutions that help manufacturers achieve greater process stability and long-term product performance. By combining technical innovation with cost-competitive solutions, we enable manufacturers to address evolving assembly requirements and strengthen their position in an increasingly competitive market.”
MacDermid Alpha Electronics Solutions continues to support electronics manufacturers throughout Southeast Asia through regional technical expertise, global manufacturing capabilities, and materials technologies developed for increasingly demanding assembly requirements.
Visitors to Booth 9E11 are invited to engage with MacDermid Alpha technical experts on material selection and assembly approaches supporting strategic manufacturing objectives.
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