TopLine and TANAKA Precious Metals will team up for an IMAPS Wire Bonding Workshop at the Crowne Plaza Boston-Woburn hotel in Woburn, MA, May 12-13, 2026. The workshop is co-located with the IMAPS New England Chapter Symposium.
TANAKA Precious Metals is the premier manufacturer of bonding wire to the semiconductor industry. TANAKA offers a full range of Gold (Au), Silver(Ag), Aluminum (Al), bare Copper (Cu) and Palladium Coated Copper (PCC) covering all applications of wedge, ball and bump bonding. Tanaka also offers high performance flat Gold and flat Al ribbon for RF modules and power applications. Pt alloy wire is also available. At the workshop, TopLine CEO Martin Hart will present “Non-Traditional Use of Bonding Wire in Solder Columns as an Alternative Interconnect for Large Heterogeneous Packages” from 11:15 am to 11:45 am on 5.12.
Hart will speak on the topic of untraditional use of Palladium coated copper bonding wire to make solder columns.
About TopLine
TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling and practice. TopLine products provide hands-on learning for engineers. TopLine is a pioneer in CGA solder columns technology and low temperature cryogenic package-to-board interconnects. For more information, contact TopLine at 1-800-776- 9888, email: info@TopLine.tv, website: www.TopLine.tv., and https://imaps.org/page/Wire-Bonding.
